Abstract: A compound has excellent thermal resistance and compatibility with resins, improves thermal resistance of resins, and specifically provides a compound represented by the following general formula (1). In formula (1), R1 to R4 each represent a C1-12 alkyl group or a C6-12 aryl group, y represents a number 1-2,000, and X1 represents a group represented by the formula (2) or (3). In formula (2), R5 represents a hydrogen atom, O., a C1-12 alkyl group or a C1-12 alkoxy group, L1 represents a C1-6 alkylene group or a C6-12 arylene group. In formula (3), R6 represents a C1-4 alkyl group or a C6-12 aryl group, X2 represents a group represented by the formula (2) or a hydrogen atom, s represents a number 2-6, L2 represents a C1-6 alkylene group or a C6-12 arylene group, and at least one of s number of X2s is the group represented by the formula (2).