Abstract: Hot-melt adhesives, useful for both glue-pot and glue-gun applications, are formulated so that they can be applied at temperatures no higher than 280.degree. F. and preferably at temperatures of at most 250.degree. F. The adhesive compositions have a heat resistance of at least 125.degree. F. and are readily shaped into glue sticks for use in glue guns, The adhesive for the hot-melt adhesive compositions is suitably compounded with tackifying resin and/or wax. The resulting composition has a sharp viscosity profile, which is readily achieved, e.g., by using a high melt index adhesive polymer as an essential component.

Abstract: Hot-melt adhesives, useful for both glue-port and glue-gun applications, are formulated so that they can be applied at temperatures no higher than 280.degree. F. and preferably at temperatures of at most 250.degree. F. The adhesive compositions have a heat resistance of at least 125.degree. F. and are readily shaped into glue sticks for use in glue guns. The adhesive for the hot-melt adhesive compositions is suitably compounded with tackifyin resin and/or wax. The resulting composition has a shape viscosity profile, which is readily achieved, e.g., by using a high melt index adhesive polymer as an essential component.