Abstract: An epoxy resin component(s) for a recyclable epoxy resin system is disclosed. The recyclable epoxy resin system comprises an epoxy resin component having a structural Formula I or an epoxy resin component having a structural Formula II and a curing agent. A process(es) for preparing the epoxy resin component having the structural Formula I and the epoxy resin system having the structural Formula II is also disclosed.

Abstract: An epoxy resin component(s) for a recyclable epoxy resin system is disclosed. The recyclable epoxy resin system comprises an epoxy resin component having a structural Formula I or an epoxy resin component having a structural Formula II and a curing agent. A process(es) for preparing the epoxy resin component having the structural Formula I and the epoxy resin system having the structural Formula II is also disclosed.

Abstract: The present invention relates to a process and system for recycling epoxy thermosets, containing cleavable bonds, said process using an acid solution to dissolve the epoxy thermoset and devolatizing the acid solution from a thermoplastic acidic mixture to produce the thermoplastic component. The process allows recovery of a recyclable thermoplastic component and optionally a recyclable reinforcement matrix component. The process comprising dissolving the epoxy thermoset in an acid solution under heated conditions resulting in a thermoplastic mixture; optionally filtering the thermoplastic mixture to separate out a reinforcement matrix component from a thermoplastic solution; and devolatizing the thermoplastic solution to obtain a recyclable thermoplastic component.

Abstract: The present disclosure relates to a modified epoxy resin having the formula (I): wherein R is R1, R2 or a combination of R1 and R2; R1 and R2 are independently alkylene group having 1 to 32 C atoms, branched alkylene group having 1 to 32 C atoms, cyclo-aliphatic group, substituted cycloaliphatic group, aromatic group, substituted aromatic group, biarylene or alkyl substituted biaryl group, cycloaliphatic-aromatic group or arylene-Z-arylene group; X and Y are independently O, —C(O)O—, or an amine group; Z is dicyclopentadiene; R3 and R4 are independently either H, alkyl group, branched alkyl group, alkoxy group, or substituted biaryl group; R4 and R3 optionally forming a fused aromatic ring or a fused hetero aromatic ring; n is 0 to 1 wherein concentration of n=0 monomer is greater than 75%; and N is 1-20.

Abstract: A slow reacting epoxy resin system is disclosed. The slow reacting epoxy resin system comprises a high purity epoxy resin component selected from the group comprising of a high purity Bisphenol A(BPA), a high purity Bisphenol F (BPF), and a combination thereof, and an amine curing agent. The initial viscosity after mixing the high purity epoxy resin component and the amine curing agent is less than 350 mPa·s at 25° C.

Abstract: A glycidyl amine epoxy resin(s) and a process for production of glycidyl amine epoxy resin(s) are disclosed. The glycidyl amine epoxy resin(s) is/are free from Bisphenol A (BPA) and Bisphenol F (BPF) and are based on AMES negative amine precursors.

Abstract: The invention relates to an improved manufacturing process for the preparation of high 2,4?-dihydroxydiphenylmethane, by a process involving reaction of phenol and formaldehyde, in the presence of an inorganic polyprotic acid. According to this process, the reaction conditions are selected to favour a high yield of dihydroxydiphenylmethane, with a relatively high concentration of the 2,4?-isomer, by using a relatively low molar excess of phenol than conventional methods.

Abstract: A self-healing hydrophobic epoxy resin composition is provided. The self-healing epoxy resin composition comprises an epoxy resin component and a hardener component, the hardener component comprises at least 0.1 weight % of a modified epoxy resin hardener. The modified epoxy resin hardener is a reaction product of an amino modified oligomericsiloxane and a carboxylic acid anhydride. A process for preparing the modified epoxy resin hardener is also disclosed.

Abstract: A process for making epoxy resin foam blocks of varying density comprising mixing together (i) a foam resin comprising: a first epoxy resin, a foaming agent to the extent of 2% to 10% of the mass of the epoxy resin, a surfactant to the extent of 2% to 6% of the mass of the epoxy resin, a filler, a toughening agent and (ii) a curing agent comprising: a hardener and a second epoxy resin, the ratio of the foam resin to curing agent being in the range of about 100:20 to 100:25 by mass to form a reaction mixture; pouring the reaction mixture inside a mold maintained at a temperature in the range of 70° to 80° C. and allowing the mixture to cure in the mold for 60 to 100 min.; allowing the mold to cool at a temperature in the range of 15° C. to 30° C. and demolding to obtain a green block; and post-curing the green block in an air circulatory oven for 10 to 15 hrs to obtain a final hard foam block.

Abstract: A process for making a molded composite comprising the following steps: reacting a reaction mass containing a polyepoxide, in the proportion of about 20% to 50% with respect to the reaction mass, a diol, in the proportion of about 10% to 20% with respect to the reaction mass, a hardener, in the proportion of about 20% to 50% with respect to the reaction mass, in the presence of an accelerator in the proportion of about 0.5 to 10.