Abstract: The present disclosure relates to a modified epoxy resin having the formula (I): wherein R is R1, R2 or a combination of R1 and R2; R1 and R2 are independently alkylene group having 1 to 32 C atoms, branched alkylene group having 1 to 32 C atoms, cyclo-aliphatic group, substituted cycloaliphatic group, aromatic group, substituted aromatic group, biarylene or alkyl substituted biaryl group, cycloaliphatic-aromatic group or arylene-Z-arylene group; X and Y are independently O, —C(O)O—, or an amine group; Z is dicyclopentadiene; R3 and R4 are independently either H, alkyl group, branched alkyl group, alkoxy group, or substituted biaryl group; R4 and R3 optionally forming a fused aromatic ring or a fused hetero aromatic ring; n is 0 to 1 wherein concentration of n=0 monomer is greater than 75%; and N is 1-20.

Abstract: A slow reacting epoxy resin system is disclosed. The slow reacting epoxy resin system comprises a high purity epoxy resin component selected from the group comprising of a high purity Bisphenol A(BPA), a high purity Bisphenol F (BPF), and a combination thereof, and an amine curing agent. The initial viscosity after mixing the high purity epoxy resin component and the amine curing agent is less than 350 mPa·s at 25° C.

Abstract: The invention relates to an improved manufacturing process for the preparation of high 2,4?-dihydroxydiphenylmethane, by a process involving reaction of phenol and formaldehyde, in the presence of an inorganic polyprotic acid. According to this process, the reaction conditions are selected to favour a high yield of dihydroxydiphenylmethane, with a relatively high concentration of the 2,4?-isomer, by using a relatively low molar excess of phenol than conventional methods.

Abstract: A self-healing hydrophobic epoxy resin composition is provided. The self-healing epoxy resin composition comprises an epoxy resin component and a hardener component, the hardener component comprises at least 0.1 weight % of a modified epoxy resin hardener. The modified epoxy resin hardener is a reaction product of an amino modified oligomericsiloxane and a carboxylic acid anhydride. A process for preparing the modified epoxy resin hardener is also disclosed.

Abstract: The invention relates to an improved process for making monomeric triglycidyl compounds, wherein the triglycidyl compounds include N, O-triglycidyl compounds containing at least one primary aromatic amine and one phenolic functional group attached to the same or a different aromatic ring. The methods of the present invention result in the production of N, O-triglycidyl compounds, such as those of formula I and II. The improved process is energy efficient, environment friendly, and results in increased yields of product. The methods of the present invention can be performed in the absence of protic organic co-solvents during the reaction of an epihalohydrin with an aminophenol, such as compounds of formula II and IV, which provides an intermediate halohydrin compound. The methods of the present invention may also be performed in the absence of a phase transfer catalyst.

Abstract: The invention relates to an improved process for making monomeric triglycidyl compounds, wherein the triglycidyl compounds include N, O-triglycidyl compounds containing at least one primary aromatic amine and one phenolic functional group attached to the same or a different aromatic ring. The methods of the present invention result in the production of N, O-triglycidyl compounds, such as those of formula I and II. The improved process is energy efficient, environment friendly, and results in increased yields of product. The methods of the present invention can be performed in the absence of protic organic co-solvents during the reaction of an epihalohydrin with an aminophenol, such as compounds of formula II and IV, which provides an intermediate halohydrin compound. The methods of the present invention may also be performed in the absence of a phase transfer catalyst.

Abstract: A self-healing hydrophobic epoxy resin composition is provided. The self-healing epoxy resin composition comprises an epoxy resin component and a hardener component, the hardener component comprises at least 0.1 weight % of a modified epoxy resin hardener. The modified epoxy resin hardener is a reaction product of an amino modified oligomericsiloxane and a carboxylic acid anhydride. A process for preparing the modified epoxy resin hardener is also disclosed.

Abstract: The invention relates to an improved manufacturing process for the preparation of high 2, 4?-dihydroxydiphenylmethane, by a process involving reaction of phenol and formaldehyde, in the presence of an inorganic polyprotic acid. According to this process, the reaction conditions are selected to favour a high yield of dihydroxydiphenylmethane, with a relatively high concentration of the 2,4?-isomer, by using a relatively low molar excess of phenol than conventional methods.

Abstract: A process for making epoxy resin foam blocks of varying density comprising mixing together (i) a foam resin comprising: a first epoxy resin, a foaming agent to the extent of 2% to 10% of the mass of the epoxy resin, a surfactant to the extent of 2% to 6% of the mass of the epoxy resin, a filler, a toughening agent and (ii) a curing agent comprising: a hardener and a second epoxy resin, the ratio of the foam resin to curing agent being in the range of about 100:20 to 100:25 by mass to form a reaction mixture; pouring the reaction mixture inside a mold maintained at a temperature in the range of 70° to 80° C. and allowing the mixture to cure in the mold for 60 to 100 min.; allowing the mold to cool at a temperature in the range of 15° C. to 30° C. and demolding to obtain a green block; and post-curing the green block in an air circulatory oven for 10 to 15 hrs to obtain a final hard foam block.

Abstract: A process for making a molded composite comprising the following steps: reacting a reaction mass containing a polyepoxide, in the proportion of about 20% to 50% with respect to the reaction mass, a diol, in the proportion of about 10% to 20% with respect to the reaction mass, a hardener, in the proportion of about 20% to 50% with respect to the reaction mass, in the presence of an accelerator in the proportion of about 0.5 to 10.0% with respect to the reaction mass either alone or in solution with compatible diluents, to obtain an epoxy resin mix having intrinsic viscosity in the range of 100 to 850 cPs, pouring the resin mix in a mold having an in-situ glass fiber scaffold at a mold temperature in the range of 45 to 50 C. and applying pressure to the resin mix in the mold to form a compressed green composition: partially curing the compressed green composition at a temperature in the range of 60 to 80 C.

Abstract: A process for making epoxy resin foam blocks of varying density comprising mixing together (i) a foam resin comprising: a first epoxy resin, a foaming agent to the extent of 2% to 10% of the mass of the epoxy resin, a surfactant to the extent of 2% to 6% of the mass of the epoxy resin, a filler, a toughening agent and (ii) a curing agent comprising: a hardener and a second epoxy resin, the ratio of the foam resin to curing agent being in the range of about 100:20 to 100:25 by mass to form a reaction mixture; pouring the reaction mixture inside a mold maintained at a temperature in the range of 70° to 80° C. and allowing the mixture to cure in the mold for 60 to 100 min.; allowing the mold to cool at a temperature in the range of 15° C. to 30° C. and demolding to obtain a green block; and post-curing the green block in an air circulatory oven for 10 to 15 hrs to obtain a final hard foam block.

Abstract: A process for making a molded composite comprising the following steps: reacting a reaction mass containing a polyepoxide, in the proportion of about 20% to 50% with respect to the reaction mass, a diol, in the proportion of about 10% to 20% with respect to the reaction mass, a hardener, in the proportion of about 20% to 50% with respect to the reaction mass, in the presence of an accelerator in the proportion of about 0.5 to 10.