Abstract: A method of producing a contact structure having contactors on a semiconductor substrate by a microfabrication technology for achieving an electrical connection with a contact target. The method includes the steps of: providing a substrate made of dielectric or semiconductor material; forming an interconnect trace on the substrate either by deposition or plating; applying microfabrication processes for forming a contactor having a base portion vertically formed on the interconnect trace, a horizontal portion whose one end is formed on the base portion and a contact portion vertically formed on another end of the horizontal portion, and attaching a sphere contact to a top end of the contact portion of the contactor.
Abstract: A packaging and interconnection for connecting a contact structure to an outer peripheral component. The packaging and interconnection includes a contact structure made of conductive material and formed on a contact substrate, a contact trace horizontally extended on the contact substrate and connected to the contact structure, a contact pad formed on a bottom surface of the contact substrate remote from the contact structure, a contact target provided at an outer periphery of the contact structure in a side-by-side fashion to be electrically connected with the contact pad, a conductive lead for electrically connecting the contact pad and the contact target, an elastomer for achieving flexibility, and a support structure for supporting the contact structure, contact substrate and elastomer.