Patents Assigned to ADURA LED SOLUTIONS, LLC
  • Printed circuit board that provides a direct thermal path between components and a thermal layer and method for assembly
    Patent number: 10531556
    Abstract: A method of assembling a component to a printed circuit board that includes a thermal layer and a circuit layer separated by a dielectric layer. The circuit layer includes circuit pads that correspond to terminal surfaces on the component. The dielectric layer includes an aperture that exposes a portion of the thermal layer that correspond to a thermal pad on the component. Solder paste is applied to the circuit pads and the exposed thermal layer. Lower surfaces of the solder paste are in contact with the circuit pads and the thermal layer and upper surfaces of the solder paste are substantially coplanar. The component is placed on the solder paste. The printed circuit board and the component are heated to create solder joints between the terminal surfaces on the component and the circuit pads and between the thermal pad on the component and the thermal layer.
    Type: Grant
    Filed: January 29, 2018
    Date of Patent: January 7, 2020
    Assignee: Adura LED Solutions, LLC
    Inventor: Kalu K. Vasoya
  • Printed circuit board that provides a direct thermal path between components and a thermal layer and method for assembly
    Patent number: 9883580
    Abstract: A method of assembling a component to a printed circuit board that includes a thermal layer and a circuit layer separated by a dielectric layer. The circuit layer includes circuit pads that correspond to terminal surfaces on the component. The dielectric layer includes an aperture that exposes a portion of the thermal layer that correspond to a thermal pad on the component. Solder paste is applied to the circuit pads and the exposed thermal layer. Lower surfaces of the solder paste are in contact with the circuit pads and the thermal layer and upper surfaces of the solder paste are substantially coplanar. The component is placed on the solder paste. The printed circuit board and the component are heated to create solder joints between the terminal surfaces on the component and the circuit pads and between the thermal pad on the component and the thermal layer.
    Type: Grant
    Filed: April 10, 2015
    Date of Patent: January 30, 2018
    Assignee: ADURA LED SOLUTIONS, LLC
    Inventor: Kalu K. Vasoya
  • Circuit board having arrangements of light-emitting diodes
    Patent number: D837171
    Type: Grant
    Filed: May 7, 2018
    Date of Patent: January 1, 2019
    Assignee: Adura LED Solutions LLC
    Inventors: Kalu K. Vasoya, Abdullah Aslami
  • Circuit board having arrangements of light-emitting diodes
    Patent number: D856948
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: August 20, 2019
    Assignee: ADURA LED SOLUTIONS LLC
    Inventors: Kalu K. Vasoya, Abdullah Aslami, Ghanshyambhai Ramani