Abstract: A package structure includes a lead frame, an electronic device and a level-maintaining structure. The electronic device is disposed adjacent to the lead frame. The level-maintaining structure is disposed between the electronic device and the lead frame, and is configured to prevent the electronic device from tilting with respect to the lead frame. The electronic device includes at least one via protruding from a bottom surface of the electronic device.

Abstract: At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package includes a first substrate with a first surface and a second surface opposite to the first surface, a second substrate adjacent to the first surface of the first substrate, and an encapsulant encapsulating the first substrate and the second substrate. The first substrate defines a space. The second substrate covers the space. The second surface of the first substrate is exposed by the encapsulant. A surface of the encapsulant is coplanar with the second surface of the first substrate or protrudes beyond the second surface of the first substrate.

Abstract: An electronic device is provided. The electronic device includes a plurality of processing units constituting a processing array having a first area, a surface supporting the processing array, and an optical channel. The surface has a second area, and the first area is greater than 80 percent of the second area. The optical channel is configured to transmit a first signal between at least two of the plurality of processing units in a first direction that is nonparallel with a normal direction of the surface.

Abstract: A package structure is provided. The package structure includes a substrate, an electronic component, and a stop layer. The substrate has a through hole including a stepped sidewall structure including a tread. The electronic component is disposed supported by the tread of the stepped sidewall structure. The stop layer is disposed on the top surface of the tread.

Abstract: An electronic device is provided. The electronic device includes a plurality of electronic components and a circuit structure connected to the plurality of electronic components. The circuit structure is configured to connect the electronic components adjacent to each other along a first path, and the circuit structure is further configured to connect the electronic components that are not adjacent to each other along a second path having a greater length and a higher speed than the first path.

Abstract: An electronic package is provided in the present disclosure. The electronic package comprises: a heat spreading component; a first electronic component disposed on the heat spreading component; and a second electronic component disposed on the first electronic component, wherein the second electronic component comprises an interconnection structure passing through the second electronic component and electrically connecting the first electronic component. In this way, through the use of the interconnection structure, the heat dissipation of the electronic components in the package can be improved. Also, through the use of the encapsulant, the stacked electronic components can be protected by the encapsulant so as to avoid being damaged.

Abstract: A package structure is provided. The package structure includes a substrate, a chip, and an adhesive layer. The substrate defines a through hole. The chip is disposed in the through hole and has a top surface and a bottom surface opposite to the top surface. The adhesive layer connects the chip to the through hole. The top surface and the bottom surface of the chip are exposed by the adhesive layer, and the chip is protruded beyond the substrate.

Abstract: An electronic device is disclosed. The electronic device includes a first pattern, a second pattern adjacent to the first pattern, and a third pattern disposed between the first pattern and the second pattern. The electronic device also includes a first feeding element and a second feeding element. The first feeding element is spaced apart from the first pattern and the third pattern and configured to electrically couple the first pattern and the third pattern to constitute a first antenna. The second feeding element is configured to electrically couple the second pattern and the third pattern to constitute a second antenna.

Abstract: A manufacturing method of an embedded component package structure includes the following steps: providing a carrier and forming a semi-cured first dielectric layer on the carrier, the semi-cured first dielectric layer having a first surface; providing a component on the semi-cured first dielectric layer, and respectively providing heat energies from a top and a bottom of the component to cure the semi-cured first dielectric layer; forming a second dielectric layer on the first dielectric layer to cover the component; and forming a patterned circuit layer on the second dielectric layer, the patterned circuit layer being electrically connected to the component.

Abstract: A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.

Abstract: A bonding structure and a package structure are provided. The bonding structure includes a first pad and a wire bundle structure. The wire bundle structure is protruded from the first pad and tapering away from the first pad. The wire bundle structure includes a first portion and a second portion, the first portion is closer to the first pad than the second portion is, and in a cross-sectional view perspective, a width of a first void in the first portion is less than a width of a second void in the second portion.

Abstract: A package structure is provided. The package structure includes a substrate and a power module. The substrate defines a cavity. The power module includes a power regulation portion and a noise filter portion, wherein the power regulation portion and the noise filter portion are disposed in the cavity of the substrate.

Abstract: A semiconductor device package is provided that includes a substrate, a first support structure disposed on the substrate and a first antenna. The first support structure includes a first surface spaced apart from the substrate by a first distance. The first antenna is disposed above the first surface of the first support structure. The first antenna has a first surface, a second surface opposite the first surface and a third surface extending from the first surface to the second surface, wherein the first surface and the second surface of the first antenna are exposed.

Abstract: The present disclosure provides an electronic device. The electronic device includes a circuit structure, a plurality of receiving components, and a plurality of transmitting components. The receiving components are disposed over the circuit structure and arranged along a first direction. The transmitting components are supported by the circuit structure. A portion of the transmitting components is misaligned along the first direction.

Abstract: An electronic device is disclosed. The electronic device includes a carrier having a first surface and a first lateral surface, an antenna adjacent to the first surface of the carrier, and a shielding layer covering a portion of the first lateral surface of the carrier. The shielding layer is configured to allow a gain of the antenna to be greater than 20 dB.

Abstract: A bonding structure and a pre-bonding structure are provided. The bonding structure includes a lower substrate; a low melting point conductive layer disposed over the lower substrate; a high melting point conductive layer including a lower portion and an upper portion, wherein the low melting point conductive layer is between the upper portion and the lower portion of the high melting point conductive layer; a dielectric layer encapsulating the low melting point conductive layer and the high melting point conductive layer; and an upper substrate disposed on the upper portion of the high melting point conductive layer, wherein an interface between the upper substrate and the high melting point conductive layer is substantially co-level with an interface between the dielectric layer and the upper substrate.

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes an antenna layer, a first circuit layer and a second circuit layer. The antenna layer has a first coefficient of thermal expansion (CTE). The first circuit layer is disposed over the antenna layer. The first circuit layer has a second CTE. The second circuit layer is disposed over the antenna layer. The second circuit layer has a third CTE. A difference between the first CTE and the second CTE is less than a difference between the first CTE and the third CTE.

Abstract: A package structure includes an interconnector, a first encapsulation layer, a second encapsulation layer. The interconnector includes a lower portion and an upper portion located on the lower portion. The first encapsulation layer encapsulates the lower portion, and has a first top surface adjacent to the upper portion. The first top surface includes a first region and a second region different from the first region. The second encapsulation layer encapsulates the upper portion, and has a second bottom surface and a second top surface. The second bottom surface faces the first top surface. The second top surface is opposite to the second bottom surface. The second top surface includes a third region and a fourth region different from the third region. A first elevation difference between a first elevation of the first region and a second elevation of the second region is greater than a second elevation difference between a third elevation of the third region and a fourth elevation of the fourth region.

Abstract: A package structure includes a wiring structure, a first electronic device, a second electronic device and a reinforcement structure. The wiring structure includes at least one dielectric layer, and at least one circuit layer in contact with the dielectric layer. The at least one circuit layer includes at least one interconnection portion. The first electronic device and the second electronic device are electrically connected to the wiring structure. The second electronic device is electrically connected to the first electronic device through the at least one interconnection portion of the at least one circuit layer. The reinforcement structure is disposed above the at least one interconnection portion of the at least one circuit layer.

Abstract: The present disclosure provides an electronic device. The electronic device includes a flexible element, and a sensing element adjacent to the flexible element and configured to detect a biosignal. The electronic device also includes an active component in the flexible element and electrically connected with the sensing element. A method of manufacturing an electronic device is also disclosed.