Abstract: A dip tube assembly having a tubular body portion and a coupler overmolded to a first end of the tubular body portion, the coupler configured for removable coupling with the mouth of a container storing contents therein. Also disclosed are a method of making the overmolded dip tube assembly and a container system including the overmolded dip tube assembly. In some embodiments, the tubular body portion and/or the coupler may include retention features molded into a surface thereof at an overmold interface between the tubular body portion and the coupler.

Abstract: A method for folding a liner for packaging and/or insertion into an overpack. The method may include providing a liner comprising a substantially tubular body portion and a closed top and bottom, and a fitment formed in or affixed to the top of the liner, forming a gusset in the bottom panel of the liner, forming a gusset in the body portion of the liner, and fan-folding the liner. In some embodiments, the top of the liner may be a substantially circular top panel and the bottom of the liner may be a substantially circular bottom panel, with the top panel being attached to one end of the tubular body portion and the bottom panel being attached to an opposite end of the tubular body portion. In other embodiments, the liner may be a flexible, blow molded liner, thereby having no weld seams.

Abstract: A method and composition for removing bulk and ion-implanted photoresist and/or post-etch residue material from densely patterned microelectronic devices is described. The composition includes a co-solvent, a chelating agent, optionally an ion pairing reagent, and optionally a surfactant. The composition may further include dense fluid. The compositions effectively remove the photoresist and/or post-etch residue material from the microelectronic device without substantially over-etching the underlying silicon-containing layer(s) and metallic interconnect materials.

Abstract: A method for metallizing a filament, wherein the filament is initially coated with a sol gel dispersion of polysilicate, titania, or alumina, and after drying at elevated temperature to form a porous interlayer coating on the filament, a nickel coating is deposited thereon from gaseous nickel carbonyl in a metallizing zone. The gaseous nickel carbonyl is produced in a fluidized bed of particulate nickel through which carbon monoxide make-up and at least a portion of the effluent gases discharged from the metallizing zone are flowed. The resulting nickel coated filament may be cut into fibers for use as a reinforcement in composite materials such as those utilized in electromagnetic inteference (EMI) shielding applications.