Abstract: A multiple-chip voltage feedback technique allows multiple strings of Light Emitting Diodes (LED's) and current sinks to be efficiently powered by a DC-to-DC voltage converter. A plurality of controllers connected in a daisy chain series monitor voltages between the connected LED's and the current sinks, progressively determine the lowest voltage, and then feed the lowest voltage back to the voltage converter. The DC-to-DC voltage converter monitors this lowest voltage and adjusts its output in order to ensure that the LED strings have adequate voltage with which to function, even as the LED's have different forward voltages and the strings are asynchronously enabled and disabled.

Abstract: An isolation structure formed in a semiconductor substrate of a first conductivity type includes a region of a second conductivity type opposite to the first conductivity type. The region of the second conductivity type is saucer-shaped and has a floor portion substantially parallel to the top surface of the substrate and a sloped sidewall portion. The sloped sidewall portion extends downward from the top surface of the substrate at an oblique angle and merges with the floor portion. The floor portion and the sloped sidewall portion together form an isolated pocket of the substrate.

Abstract: An isolation structure formed in a semiconductor substrate of a first conductivity type includes a floor isolation region of a second conductivity type opposite to the first conductivity type submerged in the substrate. A first trench extends downward from a surface of the substrate and overlaps onto the floor isolation region. The first trench includes walls lined with a dielectric material and contains a conductive material. The first trench and the floor isolation region electrically isolate a pocket of the first conductivity type from the substrate.

Abstract: An LED driver IC for driving external strings of LEDs includes a prefix register and a data register connected in series with each other and with the prefix and data registers in other driver ICs. The prefix and data registers of the driver ICs are connected in a daisy chain arrangement with an interface IC. The interface IC loads data identifying a functional latch into the prefix register and data defining a functional condition into the data register of each driver IC. The data in the data register is then transferred to the functional latch to control the functional condition within the LED driver IC.

Abstract: According to one aspect, an integrated circuit to control a power supply that supplies power to a plurality of light-emitting diode (LED) strings is provided. The integrated circuit includes an interface circuit to couple to a plurality of serial shift registers that are coupled in a daisy chain. The interface circuit may be configured to receive a plurality of digital values from the plurality of serial shift registers each corresponding to a voltage level at one end of an LED string of the plurality of LED strings and identify a lowest digital value from the plurality of digital values. The integrated circuit may further includes a converter coupled to the interface circuit that is configured to convert the lowest digital value into a control signal and provide the control signal to the power supply to adjust an output voltage of the power supply.

Abstract: A distributed system for driving strings of series-connected LEDs for backlighting, display and lighting applications that includes multiple intelligent satellite LED driver ICs connected to an interface IC via a serial lighting interface bus. The interface IC translates information obtained from a host microcontroller into instructions for the satellite LED driver ICs pertaining to such parameters as duty factor, current levels, phase delay and fault settings. Fault conditions in the LED driver ICs can be transmitted back to the interface IC. An analog current sense feedback system which also links the LED driver ICs determines the supply voltage for the LED strings.

Abstract: An active clamp current sink is used to voltage protect a low voltage rated, high power current sink that drives illumination current through a string of serially connected LEDs. When the LEDs are turned off as part of a PWM configuration, the forward voltage on the LEDs falls, and the voltage presented to the low voltage rated, high power current sink rises. The active clamp current sink monitors the voltage across the high power current sink and ensures that an adequate current flows through the LEDs. This minimally adequate current maintains a sufficiently large forward voltage through the LEDs, and therefore a sufficiently small voltage is presented to the high power current sink.

Abstract: A method of controlling an LED string having a first end coupled to a power source and a second end coupled to a first end of a current sink is provided. The method include generating a target voltage at a first end of an external inductor coupled to the second end of the current sink, comparing the target voltage to a measured voltage at the first end of the external inductor, charging the external inductor responsive to the measured voltage being greater than the target voltage, and discharging the external inductor responsive to the measured voltage being less than the target voltage.

Abstract: A current sensor to be connected in series with a power semiconductor device between a voltage supply terminal and ground. The current sensor includes a first terminal to be coupled to the power semiconductor device, a second terminal to be coupled to one of the voltage supply terminal and ground, and a current mirror. The current mirror includes a first MOSFET and a second MOSFET each having a source, a drain, and a gate. The source of the first MOSFET is connected to the source of the second MOSFET and to the second terminal, the drain of the first MOSFET is connected to the first terminal, and the gate of the first MOSFET is connected to the gate of the second MOSFET.

Abstract: A multiple chip voltage feedback technique allows multiple strings of LED's and current sinks to be efficiently powered by a DC-to-DC voltage converter within an appliance. A connected series of differential amplifiers or multiplexers are used to monitor the voltages between the connected LED's and the current sinks, progressively determine the lowest voltage, and then feed the lowest voltage back to the voltage converter. The DC-to-DC voltage converter monitors this lowest voltage and adjusts its output in order to ensure that the strings have adequate voltage with which to function, even as the LED's have different forward voltages and the strings are asynchronously enabled and disabled.

Abstract: A circuit for controlling a switching regulator is provided. The circuit includes a first input to receive a feedback signal from the switching regulator proportional to an output voltage of the switching regulator, a second input to receive a voltage reference signal, an output to be coupled to an input of the switching regulator, an error amplifier having a first input terminal coupled to the first input to receive the feedback signal, a second input terminal coupled to the second input to receive the voltage reference signal, and an output terminal coupled to the output, and a compensation network coupled between the second input and the output. The compensation network includes a series combination of a first capacitance and a first resistance coupled between the second input and a node, a second resistance coupled between the node and the output, and a second capacitance coupled to the node.

Abstract: An LED driver IC for driving external strings of LEDs comprises a prefix register and a data register connected in series with each other and with the prefix and data registers in other driver ICs. The prefix and data registers of the driver ICs are connected in a daisy chain arrangement with an interface IC. The interface IC loads data identifying a functional latch into the prefix register and data defining a functional condition into the data register of each driver IC. The data in the data register is then transferred to the functional latch to control the functional condition within the LED driver IC.

Abstract: A switching regulator that includes a high-side MOSFET, a low-side MOSFET, a high-side driver circuit, a low-side driver circuit, and a capacitive coupling circuit. An output of the high-side driver circuit is coupled to a gate of the high-side MOSFET to control the high-side MOSFET to be substantially depleted during a first operational phase and to be substantially enhanced during a second operational phase. An output of the low-side driver circuit is coupled to a gate of the low-side MOSFET to control the low-side MOSFET to be substantially enhanced during the first operational phase and to provide a regulated drain-to-source current during the second operational phase. The capacitive coupling circuit is coupled to an input of the high-side driver circuit and the gate of the low-side MOSFET and decreases the regulated drain-to-source current during a transition from the first operational phase to the second operational phase.

Abstract: A dual-polarity multiple-output boost converter that includes an inductor coupled in series between a high-side switch and a low-side switch. A first terminal of the inductor is coupled to an output of the high-side switch and the second terminal of the inductor is coupled to an input of the low side switch, with an output of low-side switch being coupled to a reference terminal. A plurality of outputs provide a plurality of output voltages, including a first plurality of outputs to provide a first plurality of different output voltages having a first polarity and at least one second output to provide at least one second output voltage having a second polarity opposite the first polarity. A control circuit is coupled to the high-side switch and the low-side switch to control an on-time of the high-side switch and the low-side switch.

Abstract: In a bump-on-leadframe semiconductor package a metal bump formed on a integrated circuit die is used to facilitate the transfer of heat generated in a semiconductor substrate to a metal heat slug and then to an external mounting surface. A structure including arrays of thermal vias may be used to transfer the heat from the semiconductor substrate to the metal bump.

Abstract: A system for controlling multiple strings of LEDs includes a group of LED driver IC's, each of which includes a current sense feedback (CSFB) sample latch for storing a digital representation of the forward-voltage drop across a controlled LED string. Each CSFB latch is coupled to a register within a serial lighting interface (SLI) bus that both originates and terminates at an interface IC. As the data on the SLI bus is shifted into the interface IC, the interface IC selects the CSFB word that represents the highest forward-voltage drop of any of the controlled LED strings, which is then used by the interface IC to generate a CSFB signal for setting the appropriate supply voltage for the controlled LED strings.

Abstract: A system for controlling multiple strings of LEDs includes a group of LED driver ICs, each of which includes a current sense feedback (CSFB) sample latch for storing a digital representation of the forward-voltage drop across a controlled LED string. Each CSFB latch is coupled to a register within a serial lighting interface (SLI) bus that both originates and terminates at an interface IC. As the data on the SLI bus is shifted into the interface IC, the interface IC selects the CSFB word that represents the highest forward-voltage drop of any of the controlled LED strings, which is then used by the interface IC to generate a CSFB signal for setting the appropriate supply voltage for the controlled LED strings.

Abstract: Isolation structures for isolating semiconductor devices from a substrate include floor isolation regions buried within the substrate and one or more trenches extending from a surface of the substrate to the buried floor isolation region.

Abstract: A stereo class-D audio system includes a first die including four monolithically integrated NMOS high-side devices and a second a second die including, four monolithically integrated PMOS low-side devices. The audio system also includes a set of electrical contacts for connecting the high and low-side devices to components within the a stereo class-D audio system, the set of electrical contacts including at least one supply contact for connecting the drains of the high-side devices to a supply voltage (Vcc) and at least one ground contact for connecting the drains of the low-side devices to ground, the electrical contacts also including respective contacts for each source of the high and low-side devices allowing the source of each high-side device to be connected to the source of a respective low-side device to form two H-bridge circuits.

Abstract: An integrated circuit for controlling a boost converter. The integrated circuit includes a gate pin, a source pin, a feedback pin, a current mirror sub-circuit, and a control sub-circuit. The current mirror sub-circuit is connected to the source pin to produce an output current from a reference current flowing between the source pin and ground, the reference current being larger than the output current. The control sub-circuit is connected to the current mirror sub-circuit, the gate pin and the feedback pin to control a gate voltage provided to the gate pin based on the output current and a feedback voltage at the feedback pin.