Patents Assigned to Advanced Bonding Technologies, Inc.
  • Patent number: 9428423
    Abstract: Method and system for bonding two or more CVD SiC articles together without the use of interface materials using applied forces from about 0.0035 MPa to about 0.035 MPa. The articles are pretreated for bonding. Graphite or other fixtures are used to apply forces in a vacuum or inert gas environment. Temperatures from about 1900° C. to about 2200° C. are used to initiate a ??? transition in the SiC to create bonded CVS SiC articles.
    Type: Grant
    Filed: May 5, 2014
    Date of Patent: August 30, 2016
    Assignee: Advanced Bonding Technologies, Inc.
    Inventors: Alina Chand, Ronald H. Chand, Stephen G. DiPietro, Vimal K. Pujari