Abstract: A low-fire, low-dielectric ceramic composition is disclosed. The ceramic composition comprises a mixture of finely divided particles consisting of 30-90% by volume of Ca—Ba—Al—Zn—Si glass and 70-10% by volume of oxides, which can be densified up to 95% at temperatures of 800-1000° C. The sintered body produced thereby exhibits a dielectric constant in the range of 6-10 and a dielectric loss in the range of 0.01%-0.5% at 1 MHz. The ceramic composition can be processed with organic solvent, polymeric binder and plasticizer to produce a green sheet which is co-firable with high electrical conductivity metal such as gold, silver, silver-palladium and copper.

Abstract: A low-fire, low-dielectric ceramic composition is disclosed. The ceramic composition comprises a mixture of finely divided particles consisting of 30-90% by volume of Ca--Pb--Al--Zn--B--Si glass and 70-10% by volume of oxides, which can be densified up to 95% at temperatures of 800-1000.degree. C. The sintered body produced thereby exhibits a dielectric constant in the range of 6-10 and a dielectric loss in the range of 0.01%-0.5% at 1 MHz. The ceramic composition can be processed with organic solvents, polymeric binders and plasticizers to produce a green sheet which is co-firable with high electrical conductivity metals such as gold, silver, silver-palladium and copper.

Abstract: A low-fire, low-dielectric ceramic composition is disclosed. The ceramic composition comprises a mixture of finely divided particles consisting of 30-90% by volume of calcium borosilicate glass and 10-70% by volume of fillers consisting essentially of Al.sub.2 O.sub.3 and amorphous SiO.sub.2, which can be densified up to 95% at temperatures of 800-1000.degree. C. The sintered body produced thereby exhibits a dielectric constant in the range of 6-9 and a dielectric loss in the range of 0.01%-0.5% at 1 MHz. The ceramic composition can be processed with organic solvent, polymeric binder and plasticizer to produce a green sheet which is co-firable with high electrical conductivity metal such as gold, silver, silver-palladium and copper.

Abstract: The present invention provides a new packaging form of a semiconductor diode, which is fabricated by using low-temperature cofired ceramic (LTCC) technology. The fabrication method is low-cost and the resulting chip form semiconductor diode has good hermeticity and high reliability. The fabrication method includes the steps of: (a) providing a ceramic green tape having a through hole for positioning a diode die; (b) positioning a diode die in the through hole; (c) sandwiching the diode die between two ceramic green tapes having printed conductive layers facing the electrode surfaces of the diode die; (d) laminating the ceramic tapes into a compact such that the conductive layers connect to the electrodes of the diode die; (e) firing the laminated parts to form a monolithic sintered body; and (f) forming end terminals, and solder-plating the end terminals to finish a ceramic chip of the semiconductor diode.