Abstract: A method for selectively removing oxidized organometallic residues, oxidized organosilicon residues, native oxides, and damaged oxides created in plasma-etching through emersion of plasma-etched silicon wafers in a solution of anhydrous ammonium fluoride and a polyhydric alcohol, which is substantially free of hydrogen fluoride and water.
Type:
Grant
Filed:
February 24, 1993
Date of Patent:
June 14, 1994
Assignee:
Advanced Chemical Systems International Incorporated