Patents Assigned to Advanced Chip Engineering Tachnology Inc.
  • Packaging structure with coplanar filling paste and dice and with patterned glue for WL-CSP
    Patent number: 7400037
    Abstract: A filling paste structure and process of wafer level package is disclosed. The process comprises filling an adhesive material to fill among plurality of dice and cover the plurality of dice. The pluralities of dice are adhered to glue pattern with viscosity in common state formed on a removable substrate. A rigid substrate is coated by adhesive material to adhere the dice. Then, pluralities of dice are departed from the glue pattern by a special environment after attaching the rigid base substrate.
    Type: Grant
    Filed: December 30, 2004
    Date of Patent: July 15, 2008
    Assignee: Advanced Chip Engineering Tachnology Inc.
    Inventors: Wen-Kun Yang, Chin-Chen Yang, Cheng-hsien Chiu, Wen-Bin Sun, Kuang-Chi Chao, His-Ying Yuan, Chun-Hui Yu