Patents Assigned to Advanced Copper Foil Inc.
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Patent number: 11584109Abstract: A supported copper foil is disclosed, comprising: a poly-based film that contains polyimide and polytetrafluoroethylene; a thin copper foil; and an adhesive provided between the poly-based film and the thin copper foil, the adhesive removably coupling the poly-based film to the copper foil.Type: GrantFiled: July 20, 2022Date of Patent: February 21, 2023Assignee: Advanced Copper Foil Inc.Inventor: Kieran Healy
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Publication number: 20220347972Abstract: A supported copper foil is disclosed, comprising: a poly-based film that contains polyimide and polytetrafluoroethylene; a thin copper foil; and an adhesive provided between the poly-based film and the thin copper foil, the adhesive removably coupling the poly-based film to the copper foil.Type: ApplicationFiled: July 20, 2022Publication date: November 3, 2022Applicant: Advanced Copper Foil Inc.Inventor: Kieran HEALY
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Patent number: 11453204Abstract: A method of manufacturing a supported copper product is disclosed. The method includes: providing a thin copper foil and a poly-based film containing polyimide and polytetrafluoroethylene, the poly-based film having an adhesive applied to a surface of the poly-based film; thermally treating the thin copper foil and the poly-based film along their respective lengths, the thermal treatment being adjustable to vary an amount of heat applied to the thin copper foil and the poly-based film; and attaching the thermally treated thin copper foil and the thermally treated poly-based film using the adhesive applied at the surface of the poly-based film.Type: GrantFiled: September 10, 2019Date of Patent: September 27, 2022Assignee: Advanced Copper Foil Inc.Inventor: Kieran Healy
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Patent number: 11044816Abstract: A burr-suppressing copper foil is described. In an embodiment, the burr-suppressing copper foil includes a poly-based film having an adhesive on a first side and an adhesive on a second side. A copper foil contacts the adhesive at the first side of the poly-based film to removably couple the poly-based film to the copper foil. A metallic burr suppressor contacts the adhesive on the second side to removably couple the poly-based film to the metallic burr suppressor.Type: GrantFiled: June 18, 2020Date of Patent: June 22, 2021Assignee: Advanced Copper Foil Inc.Inventor: Shane Hugh Stewart
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Publication number: 20210070016Abstract: A method of manufacturing a supported copper product is disclosed. The method includes: providing a thin copper foil and a poly-based film containing polyimide and polytetrafluoroethylene, the poly-based film having an adhesive applied to a surface of the poly-based film; thermally treating the thin copper foil and the poly-based film along their respective lengths, the thermal treatment being adjustable to vary an amount of heat applied to the thin copper foil and the poly-based film; and attaching the thermally treated thin copper foil and the thermally treated poly-based film using the adhesive applied at the surface of the poly-based film.Type: ApplicationFiled: September 10, 2019Publication date: March 11, 2021Applicant: Advanced Copper Foil Inc.Inventor: Kieran HEALY
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Patent number: 10716217Abstract: A burr-suppressing copper foils are described. In an embodiment, the burr suppressing copper foil includes a poly-based film having an adhesive on a first side and an adhesive on a second side. A copper foil contacts the adhesive at the first side of the poly-based film to removably couple the poly-based film to the copper foil. A metallic burr suppressor contacts the adhesive on the second side to removably couple the poly-based film to the metallic burr suppressor.Type: GrantFiled: September 15, 2016Date of Patent: July 14, 2020Assignee: Advanced Copper Foil Inc.Inventor: Shane Hugh Stewart
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Publication number: 20190315098Abstract: A method for manufacturing a printed circuit board (PCB) comprises firstly constructing a first book which includes first and second supported copper foils located at the bottom and top respectively. Each supported copper foil includes a respective poly-based film, a thin copper foil, and an adhesive provided between the film and the thin foil; the adhesive being permanently attached to the film and removably attached to the thin foil. The first book further comprises a first prepreg adjacent the thin foil of the first foil, copper clad laminates adjacent the first prepreg, and a second prepreg on a side of the copper clad laminates that opposes a side adjacent the first prepreg. Next, applying a lamination cycle to the first book using a laminating press to cure the first and second prepregs. Finally, removing the films from the thin foils associated with each of the first and second supported foil.Type: ApplicationFiled: June 25, 2019Publication date: October 17, 2019Applicant: Advanced Copper Foil Inc.Inventor: Kieran HEALY