Abstract: An apparatus for removing heat from an electronic component. In one embodiment, a heat generating device is mounted to a top-side surface of a package substrate. A fluid flow channel that is defined at least partially by a portion of the back-side surface of the substrate is provided for passing a cooling medium. This configuration permits the cooling medium to be in direct contact with the back-side surface of the substrate, thus, reducing the overall thermal resistance between the heat generating device and cooling medium.

Abstract: A method and apparatus for measuring electrical characteristics (e.g. current, voltage, phase, etc.) between a power source and a load at a set of harmonic frequencies to determine information about the load (e.g., load impedance, power dissipation, etc). According to one aspect of the invention, a first circuit detects a set of electrical characteristics (e.g., current, voltage, and/or phase) of a signal between the power source and the load. A second circuit, coupled to the first circuit to receive the set of electrical characteristics, provides data representing the set of electrical characteristics at a harmonic frequency associated with the signal. A third circuit, coupled to the second circuit, receives the data and determines information about the load (e.g., impedance, power dissipation, discharge current, etc.) at the harmonic frequency.