Abstract: A memory card is provided. The memory card comprises a substrate, a plurality of electronic package devices, a molding compound and a plastic forming material. The substrate has at least a plurality of outer contacts and a plurality of inner contacts and the outer contacts are electrically connected to the inner contacts. The electronic package devices are located on the substrate and the electronic package devices electrically connect to the inner contacts, respectively. The molding compound is covering the electronic package devices and the corresponding inner contacts. The plastic forming material is covering the molding compound and the substrate, and the plastic forming material exposes the outer contacts.

Abstract: A memory card structure comprising a substrate, a plurality of memory chips, some package material and an ultra-thin plastic shell is provided. To fabricate the memory card, a substrate having a first surface and a second surface is provided. The first surface has a plurality of outer contacts and the second surface has at least a cavity. There is a plurality of inner contacts around the cavity. Furthermore, the outer contacts and the inner contacts are electrically connected to each other. The memory chips are stacked up inside the cavity and electrically connected to the inner contacts of the substrate. Then, the memory chips and the inner contacts are encapsulated using the molding compound. Thereafter, the ultra-thin plastic shell is placed over the second surface and attached to the substrate. That portion of the ultra-thin plastic shell covering the memory chips has a thickness of about 0.1˜0.15 mm.

Abstract: A memory card structure comprising a substrate, a plurality of memory chips, some molding compound and an ultra-thin plastic shell is provided. To fabricate the memory card, a substrate having a first surface and a second surface is provided. The first surface has a plurality of outer contacts and the second surface has a cavity and a plurality of inner contacts around the cavity. The outer contacts and the inner contacts are electrically connected to each other. The memory chips are stacked up in the same area inside the cavity. Furthermore, the memory chips are electrically connected to the inner contacts. Then, the memory chips and the inner contacts are encapsulated. Thereafter, the ultra-thin plastic shell is placed over the second surface and attached to the substrate. That portion of the ultra-thin plastic shell covering the memory chips has a thickness of about 0.1˜0.4 mm.