Abstract: A structure of via hole of electrical circuit board includes an adhesive layer and a conductor layer that are formed after wiring is formed on a carrier board. At least one through hole extends in a vertical direction through the carrier board, the wiring, the adhesive layer, and the conductor layer and forms a hole wall surface. The conductor layer shows a height difference with respect to an exposed zone of the circuit trace in the vertical direction. A conductive cover section covers the conductor layer and the hole wall surface of the through hole. The carrier board is a single-sided board, a double-sided board, a multi-layered board, or a combination thereof, and the single-sided board, the double-sided board, and multi-layered board can be flexible boards, rigid boards, or composite boards combining flexible and rigid boards.

Abstract: A planarized cover layer structure of a flexible circuit board includes an insulation layer bonded through a first adhesive layer to a surface of each one of conductive signal lines laid on a substrate of a flexible circuit board. Separation areas respectively formed between adjacent ones of the conductive signal lines are each formed with a filling layer, so that the filling layer provides the first adhesive layer with a planarization height in the separation areas and the planarization height is substantially equal to the height of the conductive signal lines. The filling layer can alternatively be of a height that is higher than the surface of the conductor layer by a covering height so that the first adhesive layer has a planarization height in the separation areas and the planarization height is substantially equal to the sum of the height of the conductive signal lines and the covering height.

Abstract: A conductive connection structure for a conductive wiring layer of a flexible circuit board includes a first through hole and a second through hole formed in a lamination structure including a conductive wiring layer, a first covering layer, and a second covering layer. The first through hole extends through the first covering layer and the conductive wiring layer. The second through hole extends through the second covering layer. The second through hole is formed at a location corresponding to an exposed zone on a second surface of the conductive wiring layer and communicates with the first through hole. A first conductive paste layer is formed on a surface of the first covering layer and fills in the first through hole to form a pillar portion in the first through hole. The pillar portion has a bottom end forming a curved cap. The exposed zone of the second surface of the conductive wiring layer is at least partially covered by the curved cap.

Abstract: A differential mode signal transmission module includes a first section having an external connection end on which at least a pair of differential mode signal transmission terminals are formed and includes a grounding terminal, a first differential mode signal terminal, and a second differential mode signal terminal. The extension connection end of the first section forms a counterpart signal terminals corresponding to those of the external connection end. At least one first conductive connection line is formed on the first section. The conductive connection line connects the grounding terminal of the external connection end of the first section to a collective grounding point. The extension connection end of the first section is connected to an extension section. The extension section is further connected to a second section opposite to the first section. The extension section includes at least one slit line in order to form a bundled section.

Abstract: A composite flexible circuit planar cable includes a flat cable, a first section, and a second section. The flat cable includes a plurality of straight line like parallel and non-jumping conductor lines. At least one jumping line is formed on the first section to interchangeably connect a selected conductive line of the first section to an another selected conductive line. The second section may also form at least one jumping line to interchangeably connect a selected conductive line of the second section to an another selected conductive line. Through such a jumping line, electrical connection can be formed between signal terminals and corresponding and interchanged signal terminals. The plurality of conductor lines of the flat cable includes at least a pair of differential signal conductor lines, a grounding line, and a power line.

Abstract: An attenuation reduction control structure for high-frequency signal transmission lines of a flexible circuit board includes an impedance control layer formed on a surface of a substrate. The impedance control layer includes an attenuation reduction pattern that is arranged in an extension direction of the high-frequency signal transmission lines of the substrate and corresponds to bottom angle structures of the high-frequency signal transmission lines in order to improve attenuation of a high-frequency signal transmitted through the high-frequency signal transmission lines. An opposite surface of the substrate includes a conductive shielding layer formed thereon. The conductive shielding layer is formed with an attenuation reduction pattern corresponding to top angle structures of the high-frequency signal transmission lines.

Abstract: An attenuation reduction grounding structure of differential-mode signal transmission lines of a flexible circuit board includes a flexible substrate on which at least one pair of differential-mode signal lines, at least one grounding line, a covering insulation layer, and a thin metal foil layer are formed. At least one via hole extends through the thin metal foil layer and the covering insulation layer and corresponds to a conductive contact zone of the grounding line. The via hole is filled with a conductive paste layer to electrically connect the thin metal foil layer to the conductive contact zone of the grounding line to provide an excellent grounding arrangement. The thin metal foil layer includes a plurality of openings formed at locations corresponding to top angles of the differential-mode signal lines.

Abstract: An attenuation reduction grounding structure of differential-mode signal transmission lines of a flexible circuit board includes a flexible substrate on which at least one pair of differential-mode signal lines, at least one grounding line, a covering insulation layer, and a thin metal foil layer are formed. At least one via hole extends through the thin metal foil layer and the covering insulation layer and corresponds to a conductive contact zone of the grounding line. The via hole is filled with a conductive paste layer to electrically connect the thin metal foil layer to the conductive contact zone of the grounding line to provide an excellent grounding arrangement. The thin metal foil layer includes a plurality of openings formed at locations corresponding to top angles of the differential-mode signal lines.

Abstract: Disclosed is a flexible circuit cable with at least two bundled wire groups. The circuit cable has first and second ends respectively connected to first and second connection sections. The circuit cable includes a cluster section, which is formed of a plurality of cluster wires formed by slitting the circuit cable, in an extension direction of the cable, at a predetermined cut width. The cluster section includes at least two independent bundles, which are formed by dividing the cluster wires of the circuit cable into different signal groups according to electrical signals transmitted therethrough. Bundling members are used to the cluster wires of the independent bundles according to predetermined bundling modes. Further, the circuit cable has a surface forming a shielding conductive layer for electromagnetic interference protection and impedance control for internal signals of the circuit cable.

Abstract: A bundled flexible flat circuit cable includes a flexible substrate that forms at least one cluster section having an end forming at least one first connection section and an opposite end forming at least one second connection section. Both the first and second connection sections or one of the first and second connection sections form a stack structure. The flexible substrate can be of a structure of single-sided or double-sided substrate and may additionally include an electromagnetic shielding layer. A bundling structure is provided to bundle the cluster section at a predetermined location to form a bundled structure. The bundling structure can be made of a shielding material, an insulation material, or a combination of shielding material and insulation material.

Abstract: A connection structure for a flexible circuit cable includes a flexible circuit cable that has a flexible circuit substrate having a first end bonded to a soldering stage of the connector housing with first finger pad conductive contacts of conductive lines of the flexible circuit cable respectively corresponding to cable soldering sections of metal conductive terminals of the connector. A soldering layer is formed between a metal coating layer of the first finger pad conductive contact of each of the conductive lines and the cable soldering section of the corresponding metal conductive terminals to set the conductive lines of the flexible circuit cable in electrical connection with the metal conductive terminals of the connector.

Abstract: A bundled flexible circuit cable with water resistant structure is provided, in which a flexible substrate forms a cluster section having a lap section. In the lap section, a plurality of flat cable components that collectively form the cluster section is arranged to stack by substantially paralleling each other and corresponding up and down and is bonded and positioned by being applied with an adhesive material. The flat cable components are enclosed by a water resistant component at the lap section, whereby water, liquids, and contaminants are prevented from moving through gaps present in the bundled flexible substrate to get into the enclosure of an electronic device so as to realize protection against water, humidity, and dust. A tubular member or a wrapping member is further provided to fit over a section of the cluster section other than the lap section in order to facilitate extension through a holed mechanism device, such as a hinge, and to improve resistance against flexing and bending.

Abstract: Disclosed is a structure for precision control of electrical impedance of signal transmission circuit board. A substrate forms thereon a plurality of first signal transmission lines, and a first covering insulation layer is formed on a first surface of the substrate to cover a surface of each first signal transmission lines and each spacing section formed between adjacent first signal transmission lines. Each first signal transmission lines can transmit a differential mode signal or a common mode signal.

Abstract: A flat cable includes an enclosure sleeve that encloses a selected section of a cluster section of a flexible substrate. The enclosure sleeve has opposite ends respectively coupled to a first water resistant member and a second water resistant member. Each water resistant member includes a base forming a hollow channel and an insertion end extending from the base. The insertion end is fit to an inside or outside wall of an end of the enclosure sleeve. The first water resistant member, the second water resistant member, and the enclosure sleeve are combined together to form a water resistant section. When the flexible substrate is subjected to a stretching force in an extension direction or a torque applied in a rotation direction, the flexible substrate is allowed to undergo relative displacement with respect to the first water resistant member, the second water resistant member, and the enclosure sleeve.

Abstract: Disclosed is a detachment and displacement protection structure for insertion of flexible circuit flat cable. An inserter positioning section is formed on a flexible circuit flat cable and coupled with an inserter, which includes a metal member and a plastic member. In assembling, the plastic member is first positioned on a first surface of the inserter positioning section of the flexible circuit flat cable, and then the metal member is fit over the plastic member. A detachment and displacement protection structure is provided on the inserter positioning section to constrain the inserter from displacing and detaching in a flat cable extension direction due to being acted upon by an external force when the inserter is positioned on the inserter positioning section.

Abstract: Disclosed is a double-side-conducting flexible-circuit flat cable with cluster section, which includes a flexible circuit substrate, a first electrical conduction path, a second electrical conduction path, a plurality of first and second conductive contact zones. The flexible circuit substrate has a first surface and a second surface and includes, in an extension direction, a first connection section, a cluster section, and at least one second connection section. The cluster section is composed of a plurality of clustered flat cable components formed by slitting in the extension direction. The first and second electrical conduction paths are respectively formed on the first and second surfaces of the flexible circuit substrate and each extends along one of the clustered flat cable components of the cluster section. The plurality of first and second conductive contact zones are respectively arranged on the first and second surfaces of the flexible circuit substrate at the first connection section.

Abstract: A multilayer stacked circuit arrangement with localized separation section, has a first flat cable and first signal transmission lines arranged on the first flat cable. A second flat cable is stacked on and bonded to the first flat cable. The second flat cable further has signal transmission lines arranged on it. A bonding substance layer is formed between a first non-separation section of the first flat cable and a second non-separation section of the second flat cable for properly stacking the first and second flat cables where the separation sections are spaced apart from each other. A conductive via extends between the first non-separation section and the second non-separation section. At least some of the second signal transmission lines of the second flat cable are connected through the conductive via to the first signal transmission lines of the first flat cable.

Abstract: A flexible printed circuit board with waterproof structure includes a flexible substrate that has a first surface having a first metal layer bonded thereon. The first metal layer forms a covered area and at least one mounting zone. A bonding strength enhancing structure is formed on the mounting zone. A first insulation layer is formed on the covered area of the upper surface of the first metal layer in such a way to expose the mounting zone. A water resistant member is bonded to the bonding strength enhancing structure and a second surface of the flexible substrate.

Abstract: Disclosed is a structure of electromagnetic wave resistant connector for flexible flat cable. A flexible flat cable defines an insertion device mounting section to which an insertion device is mounted. The insertion device includes a metal member that is at least partly formed of a metal material. The flexible flat cable forms thereon conductive traces on which an insulation layer is provided. The insulation layer has a surface, which forms, in at least a portion thereof, a conductive shielding layer. The conductive shielding layer extends to the insertion device mounting section, so that when the insertion device is mounted to the insertion device mounting section, electrical connection is formed between the metal member of the insertion device and the conductive shielding layer.

Abstract: Disclosed is a flat signal transmission cable with bundling structure, including at least one flexible circuit. The flexible circuit includes a plurality of clustered flat cable components that are formed by slitting in a direction parallel to extension direction of the flexible circuit to impose free and independent flexibility for bending to each clustered flat cable component. At least one bundling structure is formed on a lateral side edge of a predetermined clustered flat cable component of the cluster section of the flexible circuit. The bundling structure forms a fastening section. When the clustered flat cable components of the cluster section of the flexible circuit are stacked to form a bundled structure, the bundling structure bundles the plurality of clustered flat cable components and is secured by being fastened by the fastening section.