Abstract: A row of disk drive slider blanks with magneto-resistive read sensors are lapped after being mounted on the flat surface of a row carrier used to mount the row assembly on a row bending tool. Residual stresses present in the row due to wafer processing are relieved by removing the kerf areas between the slider blanks prior to lapping to prevent the stresses from causing inaccuracies in the lapping process. The stability of sliders below 30% can be enhanced by using wafers thicker than is required and then slicing the extra material from the row of slider blanks after it has been bonded to the row carrier either before or after the lapping process.