Patents Assigned to Advanced Interconect Materials, LLC
  • Copper interconnection structure and method for forming copper interconnections
    Patent number: 8580688
    Abstract: A copper interconnection structure includes an insulating layer, an interconnection body including copper in an opening provided on the insulating layer, and a diffusion barrier layer formed between the insulating layer and the interconnection body. The diffusion barrier layer includes an oxide layer including manganese having a compositional ratio of oxygen to manganese (y/x) less than 2.
    Type: Grant
    Filed: September 12, 2011
    Date of Patent: November 12, 2013
    Assignee: Advanced Interconect Materials, LLC
    Inventors: Junichi Koike, Akihiro Shibatomi