Patents Assigned to ADVANCED INTERCONNECT SYSTEMS LIMITED
  • Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
    Patent number: 11205608
    Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.
    Type: Grant
    Filed: July 27, 2020
    Date of Patent: December 21, 2021
    Assignee: Advanced Interconnect Systems Limited
    Inventors: Haruki Ito, Nobuaki Hashimoto
  • Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
    Patent number: 10727166
    Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: July 28, 2020
    Assignee: Advanced Interconnect Systems Limited
    Inventors: Haruki Ito, Nobuaki Hashimoto
  • Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
    Patent number: 10636726
    Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.
    Type: Grant
    Filed: September 12, 2019
    Date of Patent: April 28, 2020
    Assignee: Advanced Interconnect Systems Limited
    Inventors: Haruki Ito, Nobuaki Hashimoto
  • Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
    Patent number: 10424533
    Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.
    Type: Grant
    Filed: June 7, 2019
    Date of Patent: September 24, 2019
    Assignee: ADVANCED INTERCONNECT SYSTEMS LIMITED
    Inventors: Haruki Ito, Nobuaki Hashimoto
  • Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
    Patent number: 10361144
    Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: July 23, 2019
    Assignee: ADVANCED INTERCONNECT SYSTEMS LIMITED
    Inventors: Haruki Ito, Nobuaki Hashimoto
  • Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
    Patent number: 10312182
    Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.
    Type: Grant
    Filed: October 8, 2018
    Date of Patent: June 4, 2019
    Assignee: ADVANCED INTERCONNECT SYSTEMS LIMITED
    Inventors: Haruki Ito, Nobuaki Hashimoto
  • Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
    Patent number: 10283438
    Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: May 7, 2019
    Assignee: ADVANCED INTERCONNECT SYSTEMS LIMITED
    Inventors: Haruki Ito, Nobuaki Hashimoto
  • Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
    Patent number: 10262923
    Abstract: A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: April 16, 2019
    Assignee: ADVANCED INTERCONNECT SYSTEMS LIMITED
    Inventors: Haruki Ito, Nobuaki Hashimoto