Patents Assigned to Advanced Interconnect Technologies
  • Ball grid array electronic package
    Patent number: 6262477
    Abstract: There is provided a ball grid array package for housing semiconductor devices. The package has a metallic base with conductive vias extending through holes formed in the base. The conductive vias terminate adjacent an exterior surface of the base. A dielectric coating on at least part of the base and through hole walls electrically isolates the metallic base from the package circuitry.
    Type: Grant
    Filed: March 19, 1993
    Date of Patent: July 17, 2001
    Assignee: Advanced Interconnect Technologies
    Inventors: Deepak Mahulikar, Paul R. Hoffman, Jeffrey S. Braden