Patents Assigned to Advanced Interconnection Corporation
  • Patent number: 6325280
    Abstract: A method of providing such an intercoupling component includes positioning terminals within holes of an insulative support member and attaching a solder ball to each of the terminals. Attaching the solder ball to the terminals is accomplished using a fixture having a number of recesses located in a pattern corresponding to a pattern of the holes in the insulative support member; filling each of the recesses with a solder ball; positioning the insulative support member over the fixture so that an end of each of the terminals contacts a corresponding solder ball; soldering the solder ball to the end of the terminal while maintaining the generally spherical shape of the solder ball; and removing the insulative support member from the fixture. The solder balls are generally soldered by passing the insulative support member with terminals and fixture with solder balls through a reflow apparatus.
    Type: Grant
    Filed: December 28, 1999
    Date of Patent: December 4, 2001
    Assignee: Advanced Interconnections Corporation
    Inventor: James V. Murphy
  • Patent number: 6313530
    Abstract: A socket terminal assembly includes a socket body having an end with an opening and an opposite end configured to contact the corresponding connection region of a printed circuit board, a contact spring, disposed at the opening of the socket body, to receive and apply a frictional force sufficient to retain the lower end of a pin within the opening of the socket body; and a resilient member, disposed within a lower end of the opening, to apply, to the pin and in response to a downward force applied to the pin, an upward force sufficient to overcome the frictional force of the contact spring. The pin has an end adapted to contact an electrical contacting area of an integrated circuit package and an opposite end configured to be inserted within the opening of the socket body. An intercoupling component includes a socket support member having holes, each hole receiving a corresponding socket terminal assembly.
    Type: Grant
    Filed: May 2, 2000
    Date of Patent: November 6, 2001
    Assignee: Advanced Interconnections Corporation
    Inventor: James V. Murphy
  • Patent number: 6256202
    Abstract: An intercoupling component (e.g., socket or adapter) is provided for increasing the dissipation of heat generated within an integrated circuit (IC) array positioned within the intercoupling component, while maintaining a relatively low profile. The intercoupling component includes a heat sink positioned within the package support member configured to contact both a lower surface of the integrated circuit package disposed within the package support member and a substrate such as a printed circuit board. The package support member includes contact terminals disposed within associated openings of the package for electrically connecting the contacting areas of the integrated circuit package to the corresponding connection regions of the substrate. The openings extend from an upper surface to an opposite lower surface of the support member and are located in a pattern corresponding to a pattern of the connection contacts. The heat sink may be configured to be removable and replaceable.
    Type: Grant
    Filed: February 18, 2000
    Date of Patent: July 3, 2001
    Assignee: Advanced Interconnections Corporation
    Inventor: James V. Murphy
  • Patent number: 6213787
    Abstract: A socket terminal assembly includes a socket body having an end with an opening and an opposite end configured to contact the corresponding connection region of a printed circuit board, a contact spring, disposed at the opening of the socket body, to receive and apply a frictional force sufficient to retain the lower end of a pin within the opening of the socket body; and a resilient member, disposed within a lower end of the opening, to apply, to the pin and in response to a downward force applied to the pin, an upward force sufficient to overcome the frictional force of the contact spring. The pin has an end adapted to contact an electrical contacting area of an integrated circuit package and an opposite end configured to be inserted within the opening of the socket body. An intercoupling component includes a socket support member having holes, each hole receiving a corresponding socket terminal assembly.
    Type: Grant
    Filed: December 16, 1999
    Date of Patent: April 10, 2001
    Assignee: Advanced Interconnections Corporation
    Inventor: James V. Murphy
  • Patent number: 6020635
    Abstract: A socket terminal assembly includes a socket body having an end with an opening and an opposite end configured to contact the corresponding connection region of a printed circuit board, a contact spring, disposed at the opening of the socket body, to receive and apply a frictional force sufficient to retain the lower end of a pin within the opening of the socket body; and a resilient member, disposed within a lower end of the opening, to apply, to the pin and in response to a downward force applied to the pin, an upward force sufficient to overcome the frictional force of the contact spring. The pin has an end adapted to contact an electrical contacting area of an integrated circuit package and an opposite end configured to be inserted within the opening of the socket body. An intercoupling component includes a socket support member having holes, each hole receiving a corresponding socket terminal assembly.
    Type: Grant
    Filed: July 7, 1998
    Date of Patent: February 1, 2000
    Assignee: Advanced Interconnections Corporation
    Inventor: James V. Murphy
  • Patent number: 5917703
    Abstract: An intercoupling component (e.g., socket or adapter) is provided for increasing the dissipation of heat generated within an integrated circuit (IC) array positioned within the intercoupling component, while maintaining a relatively low profile. The intercoupling component includes a heat sink positioned within the package support member, and having an upper surface in contact with a lower surface of the integrated circuit package disposed within the package support member. The package support member includes contact terminals disposed within associated openings of the package for electrically connecting the contacting areas of the integrated circuit package to the corresponding connection regions of the substrate. The openings extend from an upper surface to an opposite lower surface of the support member and are located in a pattern corresponding to a pattern of the connection contacts. The heat sink may be configured to be removable and replaceable.
    Type: Grant
    Filed: April 17, 1998
    Date of Patent: June 29, 1999
    Assignee: Advanced Interconnections Corporation
    Inventor: James V. Murphy
  • Patent number: 5742481
    Abstract: A socket/adapter assembly includes a insulative support member for supporting terminals soldered to connection regions of a leadless integrated circuit (IC) package, a printed circuit board, or another intercoupling component. The insulative support member is removable/replaceable from the terminals to allow visual inspection of the solder connections between the terminals and connection regions. The terminals of the socket/adapter assembly are retained by the insulative support member before the connections soldered. The insulative support member is then removed so that the individual solder connections can be examined for defective solder joints and repaired, if necessary.
    Type: Grant
    Filed: October 4, 1995
    Date of Patent: April 21, 1998
    Assignee: Advanced Interconnections Corporation
    Inventors: James V. Murphy, Robert N. Taylor
  • Patent number: 5716222
    Abstract: A plurality of rigid, generally spherical contact elements are attached to the solder balls of a ball grid array (BGA) package to provide rigid contact points that are suitable for engagement with the contacts of a direct BGA socket assembly. The contact elements include a flattened circumferential surface and a circumferential groove formed in the flattened surface. The circumferential groove divides the contact element into opposing hemispheres. An alignment assembly for aligning the contact elements with the BGA solder ball footprint includes a carrier sheet of electrically insulative, flexible material having a plurality of holes arranged in a predetermined array corresponding to the footprint of solder balls. The contact elements are snap received within the holes of the carrier sheet such that one hemisphere of the contact element is disposed on each side of the carrier sheet.
    Type: Grant
    Filed: August 8, 1996
    Date of Patent: February 10, 1998
    Assignee: Advanced Interconnections Corporation
    Inventor: James V. Murphy
  • Patent number: 5702255
    Abstract: A ball grid array socket assembly consists of a socket body having a plurality of vias extending through the socket body between upper and lower surfaces thereof, a plurality of electrically conductive contact assemblies respectively disposed in corresponding vias, and a releasable cover assembly. Each of the contact assemblies includes a lower terminal end projecting outwardly from the lower surface of the body for engaging a terminal pad on a circuit board, and further includes an upper multi-fingered contact arrangement for engaging a ball contact of a ball grid array package. Three separate embodiments of the contact assemblies are disclosed. In use, the ball grid array package is received in assembled relation with the socket body adjacent the upper surface thereof wherein the ball contacts of the ball grid array package are received into the vias in engaging electrical communication with the upper contact ends of the contact assemblies.
    Type: Grant
    Filed: November 3, 1995
    Date of Patent: December 30, 1997
    Assignee: Advanced Interconnections Corporation
    Inventors: James V. Murphy, Michael J. Murphy, Burton Fisher, Robert Taylor
  • Patent number: 5596224
    Abstract: The disclosure features lead frames, molded lead frames and adapters and sockets produced by molding these lead frames. In general, the lead frames comprise a frame and a circuit, wherein the circuit comprises a plurality of electrical conducting elements. The elements are held in position by the frame, and each element comprises an area within the element suitable for positioning a pin through the element to electrically connect the element with the board. The lead frame can be molded in plastic and trimmed to remove the frame to leave each element electrically separate from each other element.
    Type: Grant
    Filed: May 1, 1995
    Date of Patent: January 21, 1997
    Assignee: Advanced Interconnections Corporation
    Inventors: James V. Murphy, Michael J. Murphy
  • Patent number: 5438481
    Abstract: The disclosure features lead frames, molded lead frames and adapters and sockets produced by molding these lead frames. In general, the lead frames comprise a frame and a circuit, wherein the circuit comprises a plurality of electrical conducting elements. The elements are held in position by the frame, and each element comprises an area within the element suitable for positioning a pin through the element to electrically connect the element with the board. The lead frame can be molded in plastic and trimmed to remove the frame to leave each element electrically separate from each other element.
    Type: Grant
    Filed: May 20, 1993
    Date of Patent: August 1, 1995
    Assignee: Advanced Interconnections Corporation
    Inventors: James V. Murphy, Michael J. Murphy
  • Patent number: 5287617
    Abstract: An apparatus for inserting and extracting an integrated circuit package (IC) of the type having pins from terminals of a socket installed on a circuit board. The apparatus includes a package support member positioned between the package and socket, a cover attached over the package, and a socket support member between the socket and the circuit board to support the socket. The package support member has thru-holes to permit the package pins to extend through the member and engage terminals installed in the socket. The apparatus further includes an insertion/extraction member coupled to the package support member.
    Type: Grant
    Filed: August 11, 1992
    Date of Patent: February 22, 1994
    Assignee: Advanced Interconnections Corporation
    Inventor: James V. Murphy
  • Patent number: 5184285
    Abstract: A socket for connecting a first component to a circuit board. The socket includes pins for connection between the component and the board and a pair of lead frame regions, which are each electrically connected to at least one pin. Each of these regions includes a connection region for making connections to a second component. Insulative plastic is molded around the regions and defines holes through which the pins are inserted. A receptor opening is provided for receiving the second component. The first component may be an integrated circuit, the second a chip capacitor, and the socket may be a DIP socket. The capacitor may be soldered to the connection regions exposed through the receptor opening. Centering bumps may align the capacitor. The plastic may define an exposed area where each of the lead frame regions connects to respective pins, allowing for inspection of the connection between lead frame regions and respective pins.
    Type: Grant
    Filed: November 17, 1987
    Date of Patent: February 2, 1993
    Assignee: Advanced Interconnections Corporation
    Inventors: James V. Murphy, Michael J. Murphy
  • Patent number: 5168432
    Abstract: An adapter for connection of an integrated circuit package to a circuit board, the package being of the type having solder leads, and the adapter comprising a plurality of pins for connection to the circuit board, a plurality of lead frame elements, each lead frame element connected to a pin, and each lead frame element including a connection region sized and positioned for making a solder connection to a lead of an integrated circuit package, and insulative plastic molded around the pins and lead frame elements, the molded plastic body having a shape providing a plurality of grooves that each expose a connection region of one of the lead frame elements and that serve to align the solder leads with the connector regions.
    Type: Grant
    Filed: March 6, 1992
    Date of Patent: December 1, 1992
    Assignee: Advanced Interconnections Corporation
    Inventors: James V. Murphy, Michael J. Murphy
  • Patent number: 5151039
    Abstract: An adapter to connect device leads to contacts arranged in a rectangle on a circuit surface. The adapter has a body and leads that extend outwardly, downwardly and then outwardly again in a pair of opposing curves to form feet which match the pattern on the circuit surface. The body has sites for connecting with the device and supports conductive elements connecting the leads to the sites. The adapter may connect gullwing-shaped device leads disposed in a rectangle (e.g., QFP) to contacts in a similar pattern. A substrate, such as a printed circuit board, may support the conductive elements. The conductive elements and adapter leads may be portions of a lead frame with portions of the body molded around them. A connector may provide connections between attachment sites and device leads.
    Type: Grant
    Filed: April 29, 1991
    Date of Patent: September 29, 1992
    Assignee: Advanced Interconnections Corporation
    Inventor: James V. Murphy
  • Patent number: 5118298
    Abstract: An adapter that is to be conneced to contacts on a mother circuit surface. The adapter has a circuit bearing element, such as a printed circuit board, with connection sites that are connected to metalized holes opening onto its top side. Leads are anchored (e.g., by soldering) in the holes and bent down around the edge of the top side of the circuit bearing element to below it, and may be connected to the contacts on the mother circuit surface. The leads may be provided to the circuit bearing element, using lead frame elements provided in a lead frame, by bending the lead frame elements, soldering them in holes in the circuit bearing element, bending the soldered leads down around the edge of the top surface of the circuit bearing element and below it, and removing a side frame portion from the bent lead frame. Bending and cutting of the leads may be performed in a single operation with a single tool.
    Type: Grant
    Filed: April 4, 1991
    Date of Patent: June 2, 1992
    Assignee: Advanced Interconnections Corporation
    Inventor: James V. Murphy
  • Patent number: 5088930
    Abstract: A socket has several upwardly extending resilient single-reed-shaped contacts that connect to downwardly extending portions of leads of an integrated circuit package. A bottom section supports these contacts and the leads of the socket, which are connected to the contacts. The contacts may be integral to lead frame elements, make a wiping contact over at least half of the downward section or at least 0.02 inches, extend from the bottom surface of the package, press inwardly or outwardly against the package leads, and are separated and maintained in registration by ribs. A top section with ribs separates and maintains the package leads in registration and a resilient reed retains the package in the top section. A pin-and-socket connector maintains the top section in place. The package leads are retained by a surface against the force applied by the contacts.
    Type: Grant
    Filed: November 20, 1990
    Date of Patent: February 18, 1992
    Assignee: Advanced Interconnections Corporation
    Inventor: James V. Murphy
  • Patent number: 5038467
    Abstract: An apparatus and method are disclosed for making connections between the pins of a multi-pin component and sockets mounted on a circuit board. A plurality of converter elements are installed between the component pins and sockets. Each converter element includes a receptor for mating with a pin of the multiple pin component. The receptor is sized to engage a pin having any diameter within a coarse range of diameters. Each converter element also includes a precision pin for mating with a socket on the circuit board. The diameter of the precision pin is held to a tolerance so that it is within a precision range of diameters. The variation in diameter within the precision range is less than the variation within the coarse range of diameters.
    Type: Grant
    Filed: November 9, 1989
    Date of Patent: August 13, 1991
    Assignee: Advanced Interconnections Corporation
    Inventor: James V. Murphy
  • Patent number: 4985989
    Abstract: An apparatus for removing a multi-contact component installed in sockets on a circuit board. The apparatus includes at least one elongated post for providing an upward force on the lower surface of the component to remove the component from the sockets. The logitudinal axis of the post is generally normal to the lower surface of the component. At least one screw is mechanically coupled to the post so that rotation of the screw causes longitudinal movement of the post.
    Type: Grant
    Filed: November 9, 1989
    Date of Patent: January 22, 1991
    Assignee: Advanced Interconnections Corporation
    Inventor: James V. Murphy