Abstract: There is provided an edge connectable electronic package. The package has a metallic base at least partially coated with a dielectric layer. An interconnection means taking the form of either a leadframe or a circuit trace is electrically interconnected to an encased semiconductor device. The opposing end of the interconnection means extends to the package perimeter for interconnection to a socket or brazing to external leads.

Abstract: The bending of a ball grid array electronic package having a metallic base is reduced minimizing stresses applied to the innermost row of solder balls when the package base is cyclically heated and cooled. Reducing the stresses applied to the solder balls increases the number of thermal cycles before solder ball fracture causes device failure. Among the means disclosed to reduce the bending moment are a bimetallic composite base, an integral stiffener, a centrally disposed cover bonded to an external structure and a package base with a stress accommodating depressed portion.

Abstract: An apparatus and method for wire termination in wire scribed circuit boards is provided. The system includes a plurality of wires having termination areas, scribed on an insulating substrate. The top portion of the termination areas is then removed by a router to expose the wire with a flat surface. The exposed portion of the wire is then covered by a metal suitable for electrical connection bonding.

Abstract: A non-tacky, solid, adhesive composition comprising: (a) at least one film forming polymeric resin of number average molecular weight (Mn) of at least about 10,000 and having a hydroxyl, epoxide or unsaturated functionality greater than about 7, the polymeric resin being selected from the group of polyols consisting of polyesters, polyurethanes, phenoxies, epoxies and mixtures thereof; a plasticizer present in an amount which permits the activation without C-staging of the polymeric resin; (b) a curing agent which is capable of crosslinking and curing the polymeric resin to a C-stage, the curing agent being present in an amount sufficient to C-stage the polymeric resin. The adhesive composition can be activated without C-staging the polymeric resin, upon application of sufficient heat or ultrasonic energy for a time period less than one second.

Abstract: An apparatus for detecting breaks in wire while the wire is being scribed wherein the apparatus measures changes, in real time, in the scribing system's electrical characteristics. These characteristics can be changes in phase shift and capacitance variations caused by breaks in the wire as the wire is scribed onto a workpiece.

Abstract: A process for manufacturing straw tube drift chambers in an array configuration is provided. The process of manufacturing the straw tubes includes the construction of an array of tube sections, followed by the positioning of a conductive wire, and then closing the tubes. The completed straw tube array, when filled with ionizable gases, are configured about a particle accelerator collision point to provide a means for detecting the products of the collision (secondary particles) as they pass through the straw tube chambers.