Abstract: A connector alignment assembly comprises a support member having a surface from which an array of male connector pins extend outwardly, each male connector pin having a base region proximate the surface of the support member and a tip region proximate the end of each male connector pin. Guide posts extend from the surface in the direction of the array of male connector pins and compression mechanisms, one associated with each of the guide posts. The compression mechanisms are adapted to transition from the uncompressed position to a compressed position. An alignment plate has guide holes which engage with the guide posts to position the alignment plate in a spaced relationship from the surface of the support member. The alignment plate has an array of male connector pin holes which engage with the array of male connector pins.

Abstract: An intercoupling component is provided which permits reliable, non-permanent electrical connection between a first substrate and a second substrate. The intercoupling component includes a socket terminal having a first end, and a second end opposed to the first end. An axial hole extends inward from the second end, and an electrically conductive core member is disposed within the axial hole. The core member is formed of a different material than the socket terminal body, and is sized and shaped to obstruct the hole. In addition, the first end of the socket terminal is configured to receive a pin terminal, and the second end of the socket terminal is configured to be received within a hole in a printed circuit board.

Abstract: An extracting tool for extracting an adapter from a socket includes an elongate body having a first linear portion arranged to extend along a first longitudinal axis, and a second linear portion arranged to extend along a second longitudinal axis, the second longitudinal axis extending in a direction transverse to the first longitudinal axis. The body further includes an intermediate portion disposed between the first linear portion and the second linear portion. At least a portion of the intermediate portion is non-coaxial with the first longitudinal axis and the second longitudinal axis. The second linear portion is offset relative to the first linear portion in a direction transverse to the first longitudinal axis, and includes a protrusion configured to engage the socket and/or adapter.

Abstract: An electrically conductive terminal is configured for insertion into an opening in a substrate. The terminal includes a body having proximal and distal ends. The distal end is configured for insertion into the opening. The body includes a wall having an outer surface and a compliant barb that includes a base portion, an apex portion, a barb inner surface, and a barb outer surface. The base portion is disposed on the outer surface of the wall, along the body. The apex portion extends from the base portion in a direction from the distal end to the proximal end at an angle from the wall outer surface. The apex portion is located between the base and the proximal end. The barb inner surface faces the wall outer surface. The barb inner surface and the barb outer surface converge to the apex so that the cross-sectional width of the barb is non-uniform.

Abstract: An electrically conductive terminal is configured for insertion into an opening in a substrate. The terminal includes a body having proximal and distal ends. The distal end is configured for insertion into the opening. The body includes a wall having an outer surface and a compliant barb that includes a base portion, an apex portion, a barb inner surface, and a barb outer surface. The base portion is disposed on the outer surface of the wall, along the body. The apex portion extends from the base portion in a direction from the distal end to the proximal end at an angle from the wall outer surface. The apex portion is located between the base and the proximal end. The barb inner surface faces the wall outer surface. The barb inner surface and the barb outer surface converge to the apex so that the cross-sectional width of the barb is non-uniform.

Abstract: An intercoupling component is provided which permits reliable, non-permanent electrical connection between a first substrate and a second substrate. The intercoupling component includes a socket terminal having a first end, and a second end opposed to the first end. An axial hole extends inward from the second end, and an electrically conductive core member is disposed within the axial hole. The core member is formed of a different material than the socket terminal body, and is sized and shaped to obstruct the hole. In addition, the first end of the socket terminal is configured to receive a pin terminal, and the second end of the socket terminal is configured to be received within a hole in a printed circuit board.

Abstract: A connector assembly configured to electrically connect a first substrate with a second substrate is provided. The connector assembly includes an insulating support member including an array of apertures, and terminal assemblies disposed in the apertures. Each terminal assembly includes a hollow cylindrical body, and first and second terminals disposed on opposed ends of the body. The body is split by an opening extending between opposed ends, and resiliency of the body biases the first and second terminals in opposed directions along the longitudinal axis.

Abstract: An intercoupling component is provided which permits reliable, non-permanent electrical connection between a first substrate and a second substrate. The intercoupling component includes an electrically conductive terminal including a first end and a second end opposed to the first end. The first and second ends are configured to receive a solder ball. An axial hole extends inward from the first end of the terminal, and an electrically conductive core member is disposed within the hole. The core member is sized and shaped to obstruct the hole. In addition, at least an outer surface of the core member includes a first material and at least an outer surface of the body includes a second material, the first material having greater solderability than the second material.

Abstract: An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component may include a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint, one or more a shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system and a frame formed of electrically conductive material and configured to connect with the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts grouped to multi-contact groupings configured to transmit single-ended or differential signals.

Abstract: A connector assembly configured to electrically connect a first substrate with a second substrate is provided. The connector assembly includes an insulating support member including an array of apertures, and terminal assemblies disposed in the apertures. Each terminal assembly includes a hollow cylindrical body, and first and second terminals disposed on opposed ends of the body. The body is split by an opening extending between opposed ends, and resiliency of the body biases the first and second terminals in opposed directions along the longitudinal axis.

Abstract: An intercoupling component is provided that electrically connects the device leads of an integrated circuit package to a substrate. The package includes external device leads, each device lead having a downwardly extending section proximate a side of the package body, and the intercoupling component includes an insulating support member. The support member includes a first surface including first electrical attachment sites, each configured for making an electrical connection with a corresponding one of the device leads of the package. The support member also includes an opposite second surface including second electrical attachment sites in electrical contact with the first electrical attachment sites, each of the second electrical attachment sites including a plurality of solder balls associated with each device lead. The plurality of solder balls are used to form an electrical connection between each surface mount pad on the substrate and the corresponding conductive pad of the intercoupling component.

Abstract: An intercoupling component is provided which permits reliable, non-permanent electrical connection between a first substrate and a second substrate. The intercoupling component includes an electrically conductive terminal including a first end and a second end opposed to the first end. The first and second ends are configured to receive a solder ball. An axial hole extends inward from the first end of the terminal, and an electrically conductive core member is disposed within the hole. The core member is sized and shaped to obstruct the hole. In addition, at least an outer surface of the core member includes a first material and at least an outer surface of the body includes a second material, the first material having greater solderability than the second material.

Abstract: Socket terminal assemblies and intercoupling components are configured to electrically connect a contacting area of an integrated circuit with a corresponding connection region of a substrate. The socket terminal assembly includes a socket shell, a pin, and a resilient member. The socket shell includes a portion defining an interior cavity and a protrusion extending inwardly relative to the portion, the protrusion defining an opening into the cavity within the socket shell. The pin includes a first portion having a first outer dimension and defining an interior cavity within the pin, and a second portion having a second outer dimension that is smaller than the first outer dimension. The first pin portion is received within the cavity of the socket shell with the second pin portion extending through the opening and out of the socket shell. In addition, the resilient member is interposed between the socket shell and the pin.

Abstract: An intercoupling component is provided that electrically connects the device leads of an integrated circuit package to a substrate. The package includes external device leads, each device lead having a downwardly extending section proximate a side of the package body, and the intercoupling component includes an insulating support member. The support member includes a first surface including first electrical attachment sites, each configured for making an electrical connection with a corresponding one of the device leads of the package. The support member also includes an opposite second surface including second electrical attachment sites in electrical contact with the first electrical attachment sites, each of the second electrical attachment sites including a plurality of solder balls associated with each device lead. The plurality of solder balls are used to form an electrical connection between each surface mount pad on the substrate and the corresponding conductive pad of the intercoupling component.

Abstract: Socket terminal assemblies and intercoupling components are configured to electrically connect a contacting area of an integrated circuit with a corresponding connection region of a substrate. The socket terminal assembly includes a socket shell, a pin, and a resilient member. The socket shell includes a portion defining an interior cavity and a protrusion extending inwardly relative to the portion, the protrusion defining an opening into the cavity within the socket shell. The pin includes a first portion having a first outer dimension and defining an interior cavity within the pin, and a second portion having a second outer dimension that is smaller than the first outer dimension. The first pin portion is received within the cavity of the socket shell with the second pin portion extending through the opening and out of the socket shell. In addition, the resilient member is interposed between the socket shell and the pin.

Abstract: A socket terminal assembly includes a socket body having an end with an opening and an opposite end configured to contact the corresponding connection region of a printed circuit board, a contact spring, disposed at the opening of the socket body, to receive and apply a frictional force sufficient to retain the lower end of a pin within the opening of the socket body; and a resilient member, disposed within a lower end of the opening, to apply, to the pin and in response to a downward force applied to the pin, an upward force sufficient to overcome the frictional force of the contact spring. The pin has an end adapted to contact an electrical contacting area of an integrated circuit package and an opposite end configured to be inserted within the opening of the socket body. An intercoupling component includes a socket support member having holes, each hole receiving a corresponding socket terminal assembly.