Patents Assigned to Advanced Liquid Cooling Technologies Inc.
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Patent number: 12382606Abstract: A system having a shell with a shell interior for housing a heat exchanger that is configured to be operable for heat transfer between a first fluid and a second fluid; a refrigerant inlet, wherein the first fluid passes from the refrigerant inlet to the shell interior for heat transfer; a refrigerant inlet manifold, wherein the refrigerant inlet manifold is configured to collect the first fluid from the refrigerant inlet for the heat transfer; a refrigerant outlet, the refrigerant outlet is configured to be operable for supplying the first fluid for electronic device cooling; a coolant inlet, wherein the second fluid flows from the coolant inlet and into the shell interior for the heat transfer; and a coolant outlet for discharging the second fluid out of the shell interior.Type: GrantFiled: September 28, 2021Date of Patent: August 5, 2025Assignee: Advanced Liquid Cooling Technologies Inc.Inventors: Nan Chen, He Zhao, Yunshui Chen
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Patent number: 12219740Abstract: A reverse-return parallel loop system is provided, including a cooling cycle comprised of a plurality of heat sinks, at least one heat exchanger, and at least one liquid pump to carry liquid coolant through the system. Each heat sink has a vapor inlet, a liquid inlet, a vapor outlet, and a liquid outlet. The liquid coolant is pumped into the heat sink through the liquid inlet where the coolant splits in to two streams, where one stream flows out of the liquid outlet towards the next heat sink downstream, and the other stream flows through the heat sink, and through the heat exchanger core to absorb heat from the heat sources and become at least partially vaporized by the heat. This stream then merges with vapor from other heat sinks upstream and flows out through the vapor outlet back towards the heat exchanger of the system.Type: GrantFiled: June 28, 2021Date of Patent: February 4, 2025Assignee: Advanced Liquid Cooling Technologies Inc.Inventors: Nan Chen, He Zhao, Yunshui Chen
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Patent number: 12209821Abstract: A heat sink device including: a cover module having a liquid inlet; a central flow channel for distributing coolant fluid introduced into the liquid inlet of the cover module; a plurality of inner fins; a plurality of inner radial flow channels; wherein coolant fluid from the central flow channel flows into the inner radial flow channels; a ring segment disposed around an outer perimeter of the plurality of inner fins, wherein the ring segment is configured to at least one of, mix and distribute coolant fluid received from the inner radial flow channels; a plurality of outer fins; a plurality of outer radial flow channels; wherein coolant fluid from the ring segment flows into the outer radial flow channels; and an outer flow channel, wherein coolant fluid flowing out of the radial flow channels outlet drains into the outer flow channel.Type: GrantFiled: October 14, 2021Date of Patent: January 28, 2025Assignee: Advanced Liquid Cooling Technologies Inc.Inventors: Nan Chen, He Zhao, Yunshui Chen
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Patent number: 12178006Abstract: A device including a microchannel heat sink having a first layer circle A and circle B fins and a second layer circle A and circle B fins, wherein circle A fins includes a plurality of outer ring fins and circle B fins includes a plurality of inner ring fins; a cover assembly, in which the cover assembly includes adaptors, a liquid channel, a vapor channel, and a TRV chamber; a thermal regulation valve (TRV), wherein the thermal regulation valve (TRV) is configured to enable dynamic responses for temperature control in the microchannel heat sink; and a temperature sensing mechanism, in which the temperature sensing mechanism is configured to be operable for detecting temperature variations and converting the temperature variations to pressure variations.Type: GrantFiled: September 28, 2021Date of Patent: December 24, 2024Assignee: Advanced Liquid Cooling Technologies Inc.Inventors: Nan Chen, He Zhao, Yunshui Chen
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Publication number: 20220418166Abstract: A reverse-return parallel loop system is provided, including a cooling cycle comprised of a plurality of heat sinks, at least one heat exchanger, and at least one liquid pump to carry liquid coolant through the system. Each heat sink has a vapor inlet, a liquid inlet, a vapor outlet, and a liquid outlet. The liquid coolant is pumped into the heat sink through the liquid inlet where the coolant splits in to two streams, where one stream flows out of the liquid outlet towards the next heat sink downstream, and the other stream flows through the heat sink, and through the heat exchanger core to absorb heat from the heat sources and become at least partially vaporized by the heat. This stream then merges with vapor from other heat sinks upstream and flows out through the vapor outlet back towards the heat exchanger of the system.Type: ApplicationFiled: June 28, 2021Publication date: December 29, 2022Applicant: Advanced Liquid Cooling Technologies Inc.Inventors: Nan Chen, He Zhao, Yunshui Chen