Abstract: Apparatus for continuously and selectively plating a stripe of metal onto a continuously moving metal strip, said apparatus comprising a hollow, rotatably mounted plating wheel having a peripheral slot extending around the circumfery thereof, said slot communicating with the interior of said wheel, and distribution means fixedly mounted within said wheel, said distribution means comprising an electrolysis chamber and a suction chamber, means for feeding an electrolyte solution to said electrolysis chamber, and means for applying negative pressure to the suction chamber, whereby when the metal strip to be plated is maintained in driving engagement with the periphery of said wheel, said strip covers said slot, said electrolysis chamber having anode means associated therewith, and said strip being connected as a cathode, whereby electrolyte passing through said electrolysis chamber is electroplated on the exposed inner surface of the strip, with excess electrolyte continuously being drawn off through said suctio