Abstract: A lid for closing an electronics package exhibits a high corrosion resistance. The lid is formed of a metal substrate which is clad with rolled or worked nickel, and covered with a layer of gold or precious metal electroplate. At edges of the lid, which are not covered with cladding, a layer of nickel is electroplated, employing the dogbone effect to concentrate the metallization at the edges. The rolled or worked metal has a much smaller porosity than an electroplated layer, and the nickel cladding can be applied to the desired thickness in much less time than nickel electroplate.