Patents Assigned to Advanced Micro Devicees, Inc.
  • Dielectric adhesion enhancement in damascene process for semiconductors
    Patent number: 6251772
    Abstract: A method for manufacturing an integrated circuit using damascene processes is provided in which dielectric surfaces subject to chemical-mechanical polishing are roughened after polishing to increase the surface area to provide more surface for chemical and mechanical bonding of subsequent layers.
    Type: Grant
    Filed: April 29, 1999
    Date of Patent: June 26, 2001
    Assignee: Advanced Micro Devicees, Inc.
    Inventor: Dirk Brown