Patents Assigned to Advanced Micro Devics, Inc.
  • Low RC interconnection
    Patent number: 5760480
    Abstract: A low RC delay interconnection pattern is formed with a low resistivity metal, such as copper, and a low dielectric constant material, such as organic polymers. An intermediate bonding layer is formed between the low resistivity metal and low dielectric constant material employing an adhesion promoter, such as a silane-based adhesion promoter. The adhesion promoter can be applied between the metal and dielectric layers or incorporated in the dielectric layer.
    Type: Grant
    Filed: September 20, 1995
    Date of Patent: June 2, 1998
    Assignee: Advanced Micro Devics, Inc.
    Inventors: Lu You, Robin W. Cheung, Simon S. Chan, Richard J. Huang