Abstract: The present invention relates of a photonic integrated and a method of fabricating a photonic integrated chip, PIC, configured for alignment and attachment of a laser diode in a predetermined position in which light from the laser diode is aligned with an input of the PIC; wherein the photonic chip comprises an asymmetric alignment assembly for receiving and aligning the laser diode in the predetermined position; and wherein the input comprises a coupler for receiving a laser beam from the laser diode in use.

Abstract: A tunable element for an optical waveguide device, such as an Optical Phased Array (OPA), is described. Tunable element comprises three waveguide sections arranged such that light propagates through the first waveguide section, then through the second waveguide section and then through the third waveguide section, with light being either evanescently or directly coupled from one waveguide section to the next. The tunable element further comprises one or more resistive heating pad formed proximate to the second waveguide section. The first and third waveguide sections are formed from a first material and the second waveguide section is formed from a second, different material and the second material is more thermo-optically sensitive than the first material.

Abstract: Various embodiments may provide an optical phase array. The optical phase array may include a laser source configured to emit a laser. The optical phase array may further include an integrated photonic network with n stages of optical splitters, the optical splitters being 1 ? 2 optical splitters, each optical splitter of the integrated photonic network having an input, a first output, and a second output. The integrated photonic network may be configured to separate the laser into N outputs. Each output of the N outputs may differ from a neighbouring output of the N outputs by a constant phase difference (??). N may be equal to 2 to the power of n.