Patents Assigned to Advanced Optoelectronics Technology, Inc.
  • Manufacturing method for an LED comprising a nitrided AlN reflecting layer
    Patent number: 8916400
    Abstract: A light emitting diode (LED) comprises a substrate, an epitaxial layer and an aluminum nitride (AlN) layer sequentially disposed on the substrate. The AlN layer comprises a plurality of stacks separated from each other, wherein the epitaxial layer entirely covers the plurality of stacks of the AlN layer. The AlN layer with a plurality of stacks reflects upwardly light generated by the epitaxial layer and downwardly toward the substrate to an outside of LED through a top plan of the LED. A method for forming the LED is also disclosed.
    Type: Grant
    Filed: April 26, 2012
    Date of Patent: December 23, 2014
    Assignee: Advanced Optoelectronics Technology, Inc.
    Inventors: Chia-Hung Huang, Shih-Cheng Huang, Po-Min Tu, Shun-Kuei Yang, Ya-Wen Lin
  • Light emitting diode package
    Patent number: 8912558
    Abstract: An LED package includes a substrate, an LED chip arranged on the substrate, and a light transmission layer arranged on a light output path of the LED chip. The substrate includes a first electrode and a second electrode separated and electrically insulated from the first electrode. The LED chip is electrically connected to the first electrode and the second electrode of the substrate. The light transmission layer comprises two parallel transparent plates and a fluorescent layer sandwiched between the two transparent plates. The LED package further includes an encapsulation layer sealing the LED chip therein. The light transmission layer is directly located on a top surface of each LED chip, and the encapsulation layer seals the light transmission layer therein.
    Type: Grant
    Filed: March 10, 2014
    Date of Patent: December 16, 2014
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Pi-Chiang Hu, Shih-Yuan Hsu
  • Light emitting diode having N-face GaN with roughened surface
    Patent number: 8912557
    Abstract: An LED includes a substrate, a first n-type GaN layer, a connecting layer, a second n-type GaN layer, a light emitting layer, and a p-type GaN layer. The first n-type GaN layer, the connecting layer, and the second n-type GaN layer are formed on the substrate in sequence. The connecting layer is etchable by alkaline solution, and a bottom surface of the second n-type GaN layer facing towards the connecting layer has a roughed exposed portion. The GaN on the bottom surface of the second n-type GaN layer is N-face GaN. A top surface of the second n-type GaN layer facing away from the connecting layer includes a first area and a second area. The light emitting layer and the p-type GaN layer are formed on the first area of the top surface of the second n-type GaN layer in sequence.
    Type: Grant
    Filed: July 1, 2013
    Date of Patent: December 16, 2014
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Tzu-Chien Hung, Chia-Hui Shen
  • Multi-quantum well structure and light emitting diode having the same
    Patent number: 8912527
    Abstract: A multi-quantum well structure includes two first barrier layers, two well layers sandwiched between the two first barrier layers, and a doped second barrier layer sandwiched between the two well layers. The second barrier layer has its conduction band and forbidden band gradually transiting to those of one of the well layers, and a dopant concentration of the second barrier layer gradually changes along a direction from one well layer to the other. The invention also relates to a light emitting diode structure having the multi-quantum well structure.
    Type: Grant
    Filed: July 4, 2013
    Date of Patent: December 16, 2014
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Shih-Cheng Huang, Ya-Wen Lin, Po-Min Tu
  • Light emitting diode package having fluorescent film directly coated on light emitting diode die and method for manufacturing the same
    Patent number: 8906715
    Abstract: A method for packaging an LED, includes steps: providing a supporting board and then dripping a gel mixed with fluorescent therein on the supporting board; scraping the gel over the supporting board with a scraper form a gelatinous fluorescent film on the supporting board, and solidifying the gelatinous fluorescent film pieces to form a solidified fluorescent film; cutting the solidified fluorescent film into individual pieces, and peeling the solid fluorescent films from the supporting board; attaching one piece of the fluorescent film on a light outputting surface of an LED die; mounting the LED die on a substrate, and electrically connecting the LED die to the circuit structure; and forming an encapsulation on the substrate to cover the LED die.
    Type: Grant
    Filed: August 31, 2012
    Date of Patent: December 9, 2014
    Assignee: Advanced Optoelectronics Technology, Inc.
    Inventors: Lung-Hsin Chen, Wen-Liang Tseng, Pin-Chuan Chen
  • Light emitting diode package and light emitting device having the same
    Patent number: 8907371
    Abstract: An LED package includes a light transmissive encapsulation, an LED die embedded in the encapsulation from a bottom surface of the encapsulation, a positive electrode electrically connected to an anode of the LED die, and a negative electrode electrically connected to a cathode of the LED die. The encapsulation includes a light emitting surface opposite to the bottom surface thereof. The LED die includes a front surface for outputting light outward, and a back surface opposite to the front surface. The front surface is covered by the encapsulation and faces the light emitting surface of the encapsulation. The back surface is exposed outside. A light emitting device is provided by mounting the LED package to a circuit board. The circuit board has a heat conductor connecting with the LED die.
    Type: Grant
    Filed: October 28, 2011
    Date of Patent: December 9, 2014
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Shiun-Wei Chan, Chih-Hsun Ke, Chao-Hsiung Chang
  • Method for manufacturing LED package
    Patent number: 8900895
    Abstract: A method of manufacturing an LED package including steps: providing an electrode, the electrode including a first electrode, a second electrode, a channel defined between the first electrode and the second electrode, the first electrode and the second electrode arranged with intervals mutually, a cavity arranged on the first electrode, and the cavity communicating with the channel; arranging an LED chip electrically connecting with the first electrode and the second electrode and arranged inside the cavity; providing a shield covering the first electrode and the second electrode; injecting a transparent insulating material to the cavity via the channel, and the first electrode, the second electrode, and the shield being interconnected by the transparent insulating material; solidifying the transparent insulating material to obtain the LED package.
    Type: Grant
    Filed: August 30, 2013
    Date of Patent: December 2, 2014
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Hou-Te Lin, Ming-Ta Tsai
  • LIGHT EMITTING DIODE DIE
    Publication number: 20140346540
    Abstract: A light emitting diode (LED) die includes a first semiconductor layer, a second semiconductor layer, an active layer interposed between the first and second semiconductor layers, a transparent electrically conductive layer formed on the second semiconductor layer, and a passivation layer formed on the transparent electrically conductive layer. A first electrode is electrically connected with the first semiconductor layer, and a second electrode is is electrically connected with the second semiconductor layer. The transparent electrically conductive layer is made of tin doped indium oxide. The passivation layer is made of silicon nitride having a refractive index close to that of the transparent electrically conductive layer.
    Type: Application
    Filed: May 15, 2014
    Publication date: November 27, 2014
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: Tzu-Chien HUNG, Chia-Hui SHEN, Chien-Chung PENG
  • Light emitting diode with two alternative mounting sides for mounting on circuit board
    Patent number: 8896009
    Abstract: An exemplary light-emitting diode (LED) includes a substrate, a first electrode and a second electrode sandwiching the substrate therebetween, an LED chip electrically connected to the first electrode and the second electrode, a reflector located on the first electrode and the second electrode and surrounding the LED chip, and a first retaining wall mounted on an edge of the first electrode and a second retaining wall mounted on an edge of the second electrode. The first retaining wall and the second retaining wall are made of conductive material. The first retaining wall and the second retaining wall are at a same side of the LED. Outer surfaces of the first retaining wall and the second retaining wall are exposed out of the reflector.
    Type: Grant
    Filed: May 2, 2013
    Date of Patent: November 25, 2014
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Hsin-Chiang Lin, Pin-Chuan Chen
  • METHOD OF PHOTOCURING A COATING FILM
    Publication number: 20140342099
    Abstract: A method of photocuring a coating film includes steps: providing a component, and coating the coating film on the component; then a pulse UV LED light source is used to irradiate the coating film to thereby solidify the coating film. During the on time of the pulse UV light source, it supplies a UV light with an enhanced intensity to the coating film to cause a top surface of the coating film to be cured quickly. Accordingly, a reaction between oxygen and free radicals in the coating film can be effectively avoided.
    Type: Application
    Filed: May 13, 2014
    Publication date: November 20, 2014
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: TZU-CHIEN HUNG, PO-MIN TU, CHIH-PENG HSU
  • Light emitting diode with sidewise light output structure and method for manufacturing the same
    Patent number: 8890192
    Abstract: A light emitting diode (LED) includes a substrate, an electrode structure positioned on the substrate, an LED component electrically connected to the electrode structure, and a lens structure positioned on the substrate and covering the LED component. The lens structure includes a rugged structure adjacent to the substrate; the roughness of the rugged structure decreases gradually along a direction from a center of the lens structure center toward a peripheral edge thereof. The present disclosure also provides a method for manufacturing the LED light source.
    Type: Grant
    Filed: July 27, 2012
    Date of Patent: November 18, 2014
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Shih-Yuan Hsu, Hou-Te Lin
  • LED module
    Patent number: 8884325
    Abstract: An exemplary LED module includes an LED and a lens covering the LED. The lens includes a light-guiding portion over the LED and retaining portions protruding downwardly from the light-guiding portion. The LED includes a substrate, a first electrode and a second electrode mounted on the substrate, and an LED chip electrically connecting the first electrode and the second electrode respectively. Through holes are defined in the first electrode and the second electrode, respectively. Each retaining portion includes a first rugged portion and a second rugged portion. The retaining portions are inserted into the through holes correspondingly, the first rugged portion connects glue filled in a corresponding through hole, and the second rugged portion abuts the substrate, whereby the lens and the substrate are securely connected together.
    Type: Grant
    Filed: May 17, 2013
    Date of Patent: November 11, 2014
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Chao-Hsiung Chang, Hopu-Te Lin
  • Method for manufacturing light emitting diode package
    Patent number: 8883533
    Abstract: A method for manufacturing an LED package comprising steps of: providing a substrate and forming spaced electrode structures on the substrate; providing a mold on the top surface of the substrate wherein the mold defines spaced annular grooves which cooperate with the top surface of the substrate to define cavities; filling the cavities with metal material; removing the mold and hardening the metal material to form reflection cups wherein each reflection cup surrounds a corresponding electrode structure and defines a recess; polishing surfaces of the reflection cups and the electrode structures; arranging LED chips in the recesses with each LED chip electrically connected to the electrode structure; injecting an encapsulation layer in the recesses to seal the LED chips; and cutting the substrate to obtain individual LED packages.
    Type: Grant
    Filed: August 10, 2012
    Date of Patent: November 11, 2014
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Hsin-Chiang Lin, Pin-Chuan Chen, Lung-Hsin Chen
  • METHOD FOR MANUFACTURING LIGHT EMITTING DIODES
    Publication number: 20140329347
    Abstract: An exemplary method for manufacturing a light emitting diode includes following steps: providing a substrate; growing an undoped GaN layer on the substrate, the undoped GaN layer comprising an upper surface away from the substrate and a lower surface contacting the substrate; etching the upper surface of the undoped GaN layer to form a plurality of cavities; growing an Distributed Bragg Reflector layer on the upper surface of the undoped GaN layer; and forming sequentially an N-type GaN layer, an active layer and a P-type GaN layer on the Distributed Bragg Reflector layer.
    Type: Application
    Filed: March 20, 2014
    Publication date: November 6, 2014
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: CHING-HSUEH CHIU, YA-WEN LIN, PO-MIN TU, SHIH-CHENG HUANG
  • LIGHT EMITTING DIODE CHIP AND MANUFACTURING METHOD THEREOF
    Publication number: 20140327036
    Abstract: A light emitting diode (LED) chip includes an N-type semiconductor layer, a compensation layer arranged on the N-type semiconductor layer, an active layer arranged on the compensation layer; and a P-type semiconductor layer arranged on the active layer. During growth of the compensation layer, atoms of an element (i.e., Al) of the compensation layer move to fill epitaxial defects in the N-type semiconductor layer, wherein the epitaxial defects are formed due to lattice mismatch when growing the N-type semiconductor. A method for manufacturing the chip is also disclosed. The compensation layer is made of a compound having a composition of AlxGa1-xN.
    Type: Application
    Filed: October 24, 2013
    Publication date: November 6, 2014
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: CHING-HSUEH CHIU, YA-WEN LIN, PO-MIN TU, SHIH-CHENG HUANG
  • LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUCFACTURING SAME
    Publication number: 20140319564
    Abstract: A light emitting diode package for mounting to a printed circuit board by surface mounting technology includes a substrate, first and second electrodes and a light emitting diode. The first electrode and the second electrode each have a first end and a second end. The second end of the first electrode is adjacent to the first end of the second electrode and a distance therebetween is increased along a top-to-bottom direction of the light emitting diode package. The first end of the first electrode extends out of the substrate and forms a tapered structure. The second end of the second electrode extends out of the substrate and forms a tapered structure. The light emitting diode chip is electrically connected with the first and second electrodes. A method for manufacturing the light emitting diode package is also provided.
    Type: Application
    Filed: December 24, 2013
    Publication date: October 30, 2014
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: HOU-TE LIN, CHAO-HSIUNG CHANG, PIN-CHUAN CHEN, LUNG-HSIN CHEN
  • SEMICONDUCTOR LIGHT EMITTING DEVICE WITH LIGHT TRANSMISSIVE ROUGHENED STRUCTURE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20140319561
    Abstract: A semiconductor light emitting device includes a semiconductor light emitting chip and a transparent conductive layer formed on the semiconductor light emitting chip. The semiconductor light emitting chip includes a substrate, and a first semiconductor layer, an active layer and a second semiconductor layer successively formed on the substrate. The transparent conductive layer is formed on the second semiconductor layer. A first electrode and a second electrode are respectively arranged on the transparent conductive layer and the first semiconductor layer. The transparent conductive layer has a roughened structure. A method of manufacturing a semiconductor light emitting device is also provided.
    Type: Application
    Filed: November 21, 2013
    Publication date: October 30, 2014
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: YA-CHI LIEN, TZU-CHIEN HUNG
  • LIGHT EMITTING DIODE PACKAGE
    Publication number: 20140319565
    Abstract: A light emitting diode (LED) package includes a substrate, a pin structure and a reflector formed on the substrate, an LED chip arranged on the pin structure and a first encapsulation layer mixed with phosphor filled in the reflector. The LED chip includes a top surface, a side surface extending downward from the top surface and a bottom surface opposite to the top surface. A bottom end of the first encapsulation layer is located above the top surface of the LED chip. A transparent second encapsulation layer is located below the first encapsulation layer and surrounds the LED die.
    Type: Application
    Filed: March 19, 2014
    Publication date: October 30, 2014
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: CHE-HSANG HUANG, HSIN-CHIANG LIN, FU-HSIANG YEH
  • LIGHT EMITTING DIODE MODULE FOR DIRECT-TYPE BACKLIGHT MODULE
    Publication number: 20140321127
    Abstract: An LED module for use in a direct-type backlight module includes a printed circuit board, an LED arrange on the printed circuit board and electrically connected to the printed circuit board, and a lens covering the LED and fixed on the printed circuit board. A reflective layer is arranged on the printed circuit board. A semi-transparent surface is recessed and tampered from a top of a column-shaped protrusion at a center of the lens towards the LED. Part of light beams emitted from a center of the LED is refracted and diffused by the semi-transparent surface to an outside, and another part of the light beams emitted from a center of the LED is reflected by the semi-transparent surface to the reflective layer, and then reflected by the reflective layer to the outside.
    Type: Application
    Filed: November 22, 2013
    Publication date: October 30, 2014
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: CHAO-HSIUNG CHANG, CHE-HSANG HUANG, HOU-TE LIN, PIN-CHUAN CHEN
  • LIGHT EMITTING DIODE PACKAGE HAVING A TRANSPARENT METAL LAYER FUNCTION AS AN ELECTRODE THEREOF
    Publication number: 20140319549
    Abstract: A light emitting diode package includes a substrate, a reflective cup formed on the substrate, at least one light emitting diode chip formed on the substrate and surrounded by the reflective cup, a first electrode and a second electrode electrically connected with a bottom electrode and a top electrode of the light emitting diode chip, respectively. The first electrode is an electrically conductive layer, and the second electrode is a transparent and electrically conductive layer. The first electrode directly touches and electrically connects the bottom electrode of the light emitting diode chip, and the second electrode directly touches and electrically connects the top electrode of the light emitting diode chip. The first and second electrodes each have a portion extending to a bottom of the substrate.
    Type: Application
    Filed: January 14, 2014
    Publication date: October 30, 2014
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: MING-TA TSAI, CHUNG-MIN CHANG