Patents Assigned to Advanced Packaging Center BV
  • Method for die and clip attachment
    Patent number: 11289447
    Abstract: A method of die and clip attachment includes providing a clip, a die and a substrate, laminating a sinterable silver film on the clip and the die, depositing a tack agent on the substrate, placing the die on the substrate, placing the clip on the die and the substrate to create a substrate, die and clip package, and sintering the substrate, die and clip package.
    Type: Grant
    Filed: December 16, 2015
    Date of Patent: March 29, 2022
    Assignees: Alpha Assembly Solutions, Inc., Advanced Packaging Center BV
    Inventors: Oscar Khaselev, Eef Boschman