Abstract: A pair of optical components is used in an isolator that enables electric isolation. Each of the optical components includes: first lens portions arranged on different optical paths and transmitting light in a first direction; second lens portions arranged on different optical paths and transmitting light in the second direction orthogonal to the first direction; and a reflection portion reflecting, in the second direction, the light in the first direction transmitted through the first lens portion and guiding the light to the second lens portion, or reflecting, in the first direction, the light in the second direction transmitted through the second lens portion and guiding the light to the first lens portion The second lens portion included in one of the pair of optical components and the second lens portion included in the other optical component are spaced apart from each other and face each other.

Abstract: A pair of optical components is used in an isolator that enables electric isolation. Each of the optical components includes: first lens portions arranged on different optical paths and transmitting light in a first direction; second lens portions arranged on different optical paths and transmitting light in the second direction orthogonal to the first direction; and a reflection portion reflecting, in the second direction, the light in the first direction transmitted through the first lens portion and guiding the light to the second lens portion, or reflecting, in the first direction, the light in the second direction transmitted through the second lens portion and guiding the light to the first lens portion The second lens portion included in one of the pair of optical components and the second lens portion included in the other optical component are spaced apart from each other and face each other.

Abstract: The present invention provides a submount which includes a semiconductor element and which can be easily connected to an IC on a main substrate. The submount in one embodiment of the present invention includes: a substrate; electrodes; the semiconductor element; Au wires; and gold bumps. The electrodes, the semiconductor element, the Au wires, and the gold bumps, are encapsulated on the substrate by a resin. The gold bumps are formed on the electrodes and the Au wires by ball bonding and are cut by dicing such that side surfaces of the gold bumps are exposed. The exposed surfaces function as side surface electrodes of the submount.

Abstract: In manufacturing a submount, a first electrode layer (12) is formed as a layer on the surface of a submount substrate (11); a side surface (122) of the first electrode layer (12) is formed on substantially the same plane as a side surface (112) of the submount substrate (11); and the side surface (122) of the first electrode layer (12) is a connection surface for creating an electrical connection with the first electrode layer (12). By making the first electrode layer (12) sufficiently thick, the surface area of the side surface (122) can be made sufficiently large to allow, for example, wire bonding using the side surface (122). Further, components such as an optical element (14) can be protected by a sealing material (16).

Abstract: In manufacturing a submount, a first electrode layer (12) is formed as a layer on the surface of a submount substrate (11); a side surface (122) of the first electrode layer (12) is formed on substantially the same plane as a side surface (112) of the submount substrate (11); and the side surface (122) of the first electrode layer (12) is a connection surface for creating an electrical connection with the first electrode layer (12). By making the first electrode layer (12) sufficiently thick, the surface area of the side surface (122) can be made sufficiently large to allow, for example, wire bonding using the side surface (122). Further, components such as an optical element (14) can be protected by a sealing material (16).

Abstract: In order to simplify submount manufacture, and increase the manufacturing efficiency thereof, a first electrode layer (12) is formed as a layer on the surface of a submount substrate (11); a side surface (122) of the first electrode layer (12) is formed on substantially the same plane as a side surface (112) of the submount substrate (11); and the side surface (122) of the first electrode layer (12) is a connection surface for creating an electrical connection with the first electrode layer (12). By making the first electrode layer (12) sufficiently thick, the surface area of the side surface (122) can be made sufficiently large. This allows, for example, wire bonding using this side surface (122). Further, components such as an optical element (14) can be protected by a sealing material (16).

Abstract: There are provided a signal transmission device capable of improving a production efficiency and reducing a production cost, and a manufacturing method thereof. A spacer 4 is interposed between peripheral surface portions 101a of optical waveguides 101 exposed by an optical waveguide exposure section 5 and a rear surface 115 of an optical module substrate 105. A height of the spacer 4 alone allows an optical element 103 of the optical module substrate 105 to be positioned so high that this optical element 103 can actually face optical waveguide end surfaces 109. Therefore, it is not required that the spacer be individually manufactured per signal transmission device. Further, there can be avoided individual length measurements of distances such as a distance L2 between a surface 2a of a base platform 2 and the peripheral surface portions 101a of the optical waveguides 101, or the like.

Abstract: The present invention provides technology for mounting components with simple processing and with comparatively high dimensional precision. Welding sections (21) and non-welding sections (31) are formed on a surface of a substrate (1) by transferring a mask pattern. Next, fusing material (4) is arranged on the welding sections (21), and the fusing material (4) is fused to the welding sections (21). The fusing material (4) is positioned with comparatively high dimensional precision using the non-welding sections (31). Next, a component (5) is mounted on the substrate (1) with the fusing material (4) that has been fused to the welding sections (21) as positioning guides. In this way, it is possible to mount the component (5) on the substrate (1) with high dimensional precision.

Abstract: Apparatus for paint or lacquer coating of a sheet capable of coiling that has precisely one drive, which is assigned in effect to a second coiling mount, wherein essentially no further means of influencing the running characteristics of the sheet are provided for.

Abstract: Disclosed is a radiation apparatus for technical uses, especially a UV crosslinking apparatus of a printing press, coating machine, or similar. Said radiation apparatus comprises at least one radiation source emitting a processing radiation, at least one controllable and particularly wavelength-selective reflector which is assigned to the radiation source and is used for selectively directing the processing radiation onto a substrate that is to be processed or away therefrom, a driving mechanism which is effectively connected to the reflector, and a housing accommodating at least the at least one radiation source and the at least one reflector. At least one first and second radiation source are provided between which the controllable reflector is disposed and which can be operated above all in a separate manner.

Abstract: Radiation apparatus for technical use, with a large number of stretched-out radiation sources emitting in or between the UV and IR ranges and a large number of main reflector segments that are bent and/or folded out of metal sheet in a shape adapted to that of the radiation sources, while the main reflector segments are formed as separate main reflectors and are held, singly replaceable and independently of the radiation sources, in a radiation source housing.

Abstract: A coil coating process includes thermally curing the coating of an endless strip by near infrared radiation in a curing oven provided with near infrared emitters and the subsequent destruction of volatile solvents contained in exhaust air of the curing oven by thermal oxidizing in an oxidizer chambers. Heat introduced into the solvent within the curing step is used in the oxidizing step.

Abstract: Apparatus for paint or lacquer coating of a sheet capable of coiling that has precisely one drive, which is assigned in effect to a second coiling mount, wherein essentially no further means of influencing the running characteristics of the sheet are provided for.

Abstract: Radiation module for thermal or UV irradiation processing procedures with a large number of radiation sources essentially adjacent and parallel to one another for electromagnetic radiation whose main effective range is in the UV spectrum, visible spectrum, and/or near infrared (NIR) part of the spectrum, particularly at wavelengths between 250 nm and 1.5 ?m, whereby each of the radiation sources possesses an elongated central section, two bent ends, and two bent sections connecting the ends with the central section, and a reflector and cooler body bearing the radiation sources, whereby the reflector and cooler body possesses two end reflector sections assigned to the bent sections of the radiation source from the straight elongated main section to the ends formed as one piece.

Abstract: Periodically poled crystals and a hydrothermal growth method for making such are disclosed. Electronically periodically poled crystals are employed as seed crystals in a hydrothermal growth process in order to produce novel crystals having deep ferroelectric domains.

Abstract: Method of manufacturing a semiconducting organic laminated structure, for use in an electronic circuit, in particular a logic and/or memory circuit, wherein a substrate is coated with a solution or dispersion containing a small proportion of an organic composite and having a certain wet-layer thickness, which by drying is converted into an organic thin layer with semiconducting properties that adheres to the substrate and has a dry-layer thickness substantially less than the wet-layer thickness, in particular by an order of magnitude or more, the drying being accomplished by brief irradiation with electromagnetic radiation that has its main effective component in the near-infrared range, in particular in the region between 0.8 and 1.5 ?m.

Abstract: The invention relates to a method and a system for irradiating objects with infrared radiation, in particular in order to dry surface layers and/or fix them in place, wherein a radiation source (10) is moved by means of a robot (1) into one or several operating positions in which the particular target object is irradiated.

Abstract: The invention relates to a method of drying coated and/or impregnated objects (5), in particular lacquered wood, wherein [drying of] a coating agent and/or impregnation agent applied to the surface of the object concerned is completed before a characteristic period of time has elapsed, by irradiating the coated or impregnated surface with infrared radiation. The characteristic period of time is determined by the time needed for components of the coating and/or impregnation agent (22) to migrate away, i.e. by penetrating into the object (5), so that the quality of the coating or impregnation is impaired. Alternatively or in addition, the characteristic period of time is determined by the fact that after it has elapsed, a solvent and/or dilution fluid that is contained in the coating and/or impregnation agent (22) and is to be driven out and/or bound during the heating process has caused fibers in the object (5) to be raised up, so that a secondary treatment of the surface is necessary or desirable.

Abstract: The invention relates to a method for preparing a conductive electrode comprising applying a precursor for electrocatalytic or protective coatings on a conductive electrode substrate, irradiating the conductive electrode substrate and the precursor with near infrared (NIR) radiation to form an electrocatalytic or protective coating on the electrode substrate. The invention also relates to an electrode substrate or electrode obtainable by the method, and the use thereof.

Abstract: Method of removing dents from sheet-metal parts, in particular from lacquered parts of an automobile body, wherein the metal part (3) in the region of a dent (B) is warmed locally in a substantially non-contact manner, in such a way that a mechanical tension gradient produced by the local warming causes the dent to spring back so as to restore the original shape of the metal part.