Abstract: A thermally curable polymer thick film compositions comprising, by weight:(a) about 3--15 parts of at least one poly(hydroxystyrene) resin;(b) a crosslinking resin selected from the group consisting of:(i) about 5-25 parts of at least one blocked isocyanate resin; or(ii) about 2-10 parts of at least one melamineformaldehyde resin;(c) an effective amount of at least one organic solvent capable of substantially dissolving (a) and (b) ingredients;(d) conductive particulate matter selected from the group consisting of:(i) about 50-80 parts silver flake;(ii) a graphite/carbon black mixture consisting of:(aa) about 15-45 parts graphite; and(bb) about 1-10 parts carbon black; or(iii) a mixture of (i) and (ii).

Abstract: A thermally curable conductive polymer thick film composition comprising, by weight:(a) about 3-15 parts of at least one thermoplastic vinyl acetate/vinyl chloride/dicarboxylic acid multipolymer resin;(b) a second thermoplastic resin selected from the group consisting of:(i) about 1-6 parts of at least one thermoplastic polyurethane resin;(ii) about 2-10 parts of at least one thermoplastic polyurethane resin;(iii) about 1-10 parts of a mixture of at least one thermoplastic polyurethane and at least one thermoplastic polyester resin;(c) about 0.05-1 parts of a tertiary amine;(d) an effective amount of at least one organic solvent capable of substantially dissolving (a), (b), and (c) ingredients; and(e) about 50-80 parts of silver flake.

Abstract: A thermally curable conductive polymer thick film composition comprising, by weight:(a) about 3-15 parts of at least one thermoplastic vinyl acetate/vinyl chloride/dicarboxylic acid multipolymer resin;(b) a second thermoplastic resin selected from the group consisting of:(i) about 1-6 parts of at least one thermoplastic polyurethane resin;(ii) about 2-10 parts of at least one thermoplastic polyester resin; or(iii) about 1-10 parts of a mixture of at least one thermoplastic polyurethane and at least one thermoplastic polyester resin;(c) about 0.05-1 parts of a tertiary amine;(d) an effective amount of at least one organic solvent capable of substantially dissolving (a), (b), and (c) ingredients; and(e) about 50-80 parts of silver flake.

Abstract: A thermally curable polymer thick film compositions comprising, by weight:(a) about 3-15 parts of at least one poly(hydroxystyrene) resin;(b) a crosslinking resin selected from the group consisting of:(i) about 5-25 parts of at least one blocked isocyanate resin; or(ii) about 2-10 parts of at least one melamineformaldehyde resin;(c) an effective amount of at least one organic solvent capable of substantially dissolving (a) and (b) ingredients;(d) conductive particulate matter selected from the group consisting of:(i) about 50-80 parts silver flake;(ii) a graphite/carbon black mixture consisting of:(aa) about 15-45 parts graphite; and(bb) about 1-10 parts carbon black; or(iii) a mixture of (i) and (ii).

Abstract: A conductive silver/silver chloride composition consisting essentially of:(a) about 5 to about 15 parts by weight of a polyester or phenoxy thermoplastic polymer or mixtures thereof;(b) at least a sufficient amount of an organic solvent capable of dissolving polymer (a);(c) about 35 to about 60 parts by weight of silver flake; and(d) about 5 to about 20 parts by weight silver chloride.

Abstract: A thermally curable conductive polymer thick film composition comprising an uncured admixture of:(a) a resin system comprising an admixture of:(i) about 4.50 parts to about 12 parts by weight of at least one phenoxy resin; and(ii) about 6 parts to about 15.5 parts by weight of at least one blocked polyisocyanate resin; and(b) a particulated electrically conductive material selected from the group consisting of:(i) about 50 parts to about 70 parts by weight silver flake; and(ii) a mixture of about 15 parts to about 25 parts by weight graphite and about 3 parts to about 6 parts by weight carbon black.

Abstract: A conductive die attach composition containing no solvent and substantially no ionic impurities which comprises:(a) an epoxy resin system comprising (i) at least one low viscosity epoxy resin; and (ii) at least one epoxy resin hardener;(b) at least one unsaturated monomer which, when polymerized, is not capable of reacting with said epoxy resin system;(c) at least one free radical initiator for polymericing said unsaturated monomer; and(d) finely divided silver particles.

Abstract: An actinic radiation curable polymer thick film composition comprising by weight:(a) about 10 to about 20 parts of an unsaturated monomer capable of being polymerized by actinic radiation;(b) about 2.5 to about 8 parts of at least one thermoplastic polymer having a glass transition value of above about 100.degree. F. and not capable of being substantially cross-linked with monomer (a) and said polymer (b) is dissolved in monomer (a);(c) about 68 to about 85 parts of conductive metal particles; and(d) about 0.1 to about 5 parts of at least one actinic radiation polymerization initiator.

Abstract: A conductive silver/silver chloride composition consisting essentially of:(a) about 6 to about 10.5 parts by weight of a vinylidene chloride thermoplastic polymer having a glass transition value of above about 100.degree. F.;(b) at least a sufficient amount of an organic solvent capable of dissolving polymer (a);(c) about 47 to about 57 parts by weight of silver flake; and(d) about 8 to about 16 parts by weight of silver chloride.

Abstract: A method of improving the quality of hot pressed Si.sub.3 N.sub.4 bodies is disclosed. Unpurified silicon powder and admixed oxygen carrying agents are compacted to form a preform. The preform is nitrided, facilitated by the presence of certain impurities, to agglomerate the mixture to an increased density no greater than 2.7 gm/cm.sup.3. The nitrided preform is immersed in one or more stages in one or more leaching solutions of effective concentration to remove the selected impurities. The treated preform is then hot pressed to full density accompanied by a substantial reduction or absence of undesirable impurities such as iron silicide, which can conventionally form during hot pressing.