Patents Assigned to ADVANCED SEMICOMDUCTOR ENGINEERING, INC.
  • Semiconductor device structure having semiconductor die bonded to redistribution layer via electrical pad with barrier layer
    Patent number: 10763234
    Abstract: A wiring structure includes a redistribution layer and an electrical pad. The redistribution layer includes a passivation layer and a metal layer. The metal layer is embedded in the passivation layer, and the passivation layer defines an opening to expose a portion of the metal layer. The electrical pad is disposed in the opening of the passivation layer and on the metal layer. The electrical pad includes a seed layer, a conductive layer, a barrier layer and an anti-oxidation layer.
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: September 1, 2020
    Assignee: ADVANCED SEMICOMDUCTOR ENGINEERING, INC.
    Inventors: Ming Hsien Chu, Chi-Yu Wang