Patents Assigned to Advanced Semiconductor Enigneering, Inc.
  • Wire bonding process and wire bond structure
    Patent number: 6863208
    Abstract: In a wire-bonding process, a chip is provided with at least a first contact pad. A chip carrier is further provided with at least a second contact pad. A plurality of stacked conductive bumps are formed on the first contact pad. A conductive wire is formed by a reverse bonding process. The conductive wire electrically connects the second contact pad of the chip carrier to the stacked conductive bumps over the first contact pad of the chip.
    Type: Grant
    Filed: December 31, 2002
    Date of Patent: March 8, 2005
    Assignee: Advanced Semiconductor Enigneering, Inc.
    Inventor: Chun-Chi Lee