Patents Assigned to ADVANCED SEMlCONDUCTOR ENGINEERING, INC.
  • Method for manufacturing assembly structure by using frame structure on substrate
    Patent number: 11848280
    Abstract: An assembly structure and a method for manufacturing the same are provided. The method for manufacturing the assembly structure includes providing a substrate defining an active region and a side rail surrounding the active region; and forming a frame structure on the side rail.
    Type: Grant
    Filed: November 25, 2020
    Date of Patent: December 19, 2023
    Assignee: ADVANCED SEMlCONDUCTOR ENGINEERING, INC.
    Inventors: Wen Hung Huang, Yu-Ju Liao