Patents Assigned to ADVANCED SEMSCONDUCTOR ENGINEERING, INC.
  • Semiconductor device package and a method of manufacturing the same
    Patent number: 10658255
    Abstract: A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: May 19, 2020
    Assignee: ADVANCED SEMSCONDUCTOR ENGINEERING, INC.
    Inventors: Tsung-Yu Lin, Pei-Yu Wang, Chung-Wei Hsu