Abstract: A water jet handler (200) has a loading location (205), a cutting location (210), and an unloading location (215); and two movable mounts (240 and a 245). As a first movable mount (240) receives a molded substrate at the loading location (205), and transports it to the cutting location (210), a second movable mount (245) transports singulated semiconductor packages of a previously singulated molded substrate from the cutting location (210) to the unloading location (215). As the molded substrate on the first movable mount (240) is cut in the X direction (232) by a water jet, the singulated semiconductor packages are unloaded. The molded substrate is then transferred to the second movable mount (245) on which it is cut in the Y direction (272) to produce singulated semiconductor packages, as the first movable mount (240) returns to the loading location (205), when another molded substrate is loaded.

Abstract: A test handler for picking up semiconductor devices from a conveying system and placing them at testing positions and returning the tested devices to the conveying system efficiently and modularly is shown. The basic apparatus has two concentric shafts each connected at one end to a cam following assembly and at the other end to a pick and place arm. The assembly has a block with a center bore for accommodating a ball screw and a longitudinal channel for receiving a lever cum cam follower subassembly connected to one end of the concentric shafts. The cam follower assembly and the concentric shafts translate the rotational movement of the ball screw into radial movement of the pick and place arms between the conveying system and the test rig. Another pick and insertion assembly associated detachably with the pick and place arms alternately picks up semiconductor devices from the conveying system and places them in position for testing.

Abstract: A wedge device for a press for controllably exerting high amounts of force in a clamping operation during a semiconductor packaging process and for facilitating a linear force output in relation to its input. The wedge device is powered by a servo motor which is coupled to a planetary screw by a set of pulleys and a timing belt. The screw is mated with a nut which is prevented from rotating so that the rotation of the screw causes the nut to move in a linear direction. Metal extensions join the nut to a bottom wedge such that the wedge moves together with the nut. Slidably disposed on top of the bottom wedge is a block bearing firmly attached to a complementary wedge. The complementary wedge is free to move in a vertical direction but not in a horizontal direction. As the bottom wedge moves in a horizontal direction, the complementary wedge moves in a vertical direction. The complementary wedge is placed underneath a press to provide the clamping force necessary for a semiconductor packaging operation.

Abstract: An apparatus and method for reducing warpage in semiconductor packages, and in particular, thin quad flat packages (TQFPs). The apparatus includes a clamping jig having a bottom plate and an upper plate. The bottom plate is connected to a heater which heats the plate to approximately 50 to 70 degrees Celsius. An air supply controller delivers air supply to the upper plate. The TQFPs are placed in between the bottom plate and the upper plate immediately after they have been encapsulated with resin and the resin has cured. The clamping jig clamps the TQFPs in between the bottom and upper plate with a slight force. The TQFPs remain in the clamping jig until they have sufficiently cooled.

Abstract: A BGA mould assembly which can facilitate high degree of control over the clamping force on BGA substrates of varying thickness. An Independent drive is provided for each of the dual in-line cavity bars which clamp the BGA substrates. The drive mechanism is a wedge press which includes a servo motor, and a linear-conversion mechanism coupled to the servo motor to convert the rotation motion of the motor to a linear movement. An input wedge is coupled to the linear-conversion mechanism such that the input wedge moves correspondingly with the linear movement of the linear conversion mechanism. An output wedge is coupled to the cavity bar and positioned such that a horizontal movement by the input wedge causes the output wedge to move downwards. A roller cage is provided at the top and bottom of the input wedge to reduce friction.