Abstract: A convection heat attachment and removal system for surface mounted assemblies is disclosed which uses a flow of heated gas to heat and melt solder contacts between surface mounted components and printed circuit boards. The system protects components adjacent to the workpiece by confining the flow of hot gas within a nozzle conduit which encompasses the workpiece. The system also protects the workpiece from overheating and thermal shock by shielding the workpiece from direct incidence of hot gas and by cooling the top surface of the workpiece with cool air. Relative positioning of the workpiece, the printed circuit board and the source of convection heat is accomplished by an arm mechanism as well as an X-Y table. The positioning means in this system are designed to accommodate a method of precise positioning disclosed herein. Convenient physical and visual access is provided to the workpiece and its location on the printed circuit board at any time during positioning.