Patents Assigned to Advanced Technologies Materials, Inc.
  • Substantially rigid collapsible container with fold pattern
    Patent number: 9290296
    Abstract: The present disclosure relates to a blow-molded, rigid collapsible container that can be suitable for storage and dispensing systems of practically any size. The rigid collapsible container may be a stand-alone container. The container may be blow-molded as a unitary piece that may include folds or pre-folds that allows the container to collapse into a relatively flat position. In an expanded state, the container may have a generally trapezoidal prism shape.
    Type: Grant
    Filed: August 22, 2012
    Date of Patent: March 22, 2016
    Assignee: Advanced Technologies Materials, Inc.
    Inventors: Glenn Tom, Thea Annette Ellingson, Amy Koland, Dale Gene Mowrey
  • Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structures
    Patent number: 6660700
    Abstract: A semiconductor wafer cleaning formulation, including 2-98% wt. organic amine, 0-50% wt. water, 0.1-60% wt. 1,3-dicarbonyl compound chelating agent, 0-25% wt. of additional different chelating agent(s), 0.5-40% wt. nitrogen-containing carboxylic acid or an imine, and 2-98% wt polar organic solvent. The formulations are useful to remove residue from wafers following a resist plasma ashing step, such as inorganic residue from semiconductor wafers containing delicate copper interconnecting structures.
    Type: Grant
    Filed: November 15, 2001
    Date of Patent: December 9, 2003
    Assignee: Advanced Technologies Materials, Inc.
    Inventors: William A. Wojtczak, Ma. Fatima Seijo, David Bernhard, Long Nguyen