Patents Assigned to Advanced Technology Interconnect, Inc.
  • Patent number: 5952083
    Abstract: Anodizable components for electronic packaging applications, such as substrates for printed circuit boards or ball grid array electronic packages, having conductive circuitry formed on an electrically non-conductive anodic film. To inhibit the formation of electrically conductive precipitates in the anodic film that can form an electrical short circuit between the circuit traces and the metallic core of the component, the metallic core is formed from an anodizable alloy having below thresholds of precipitate forming constituents. Such precipitate forming constituents include iron, silicon and manganese.
    Type: Grant
    Filed: October 21, 1997
    Date of Patent: September 14, 1999
    Assignee: Advanced Technology Interconnect, Inc.
    Inventors: Arvind Parthasarathi, Satish Jalota, Jeffrey Schlater, Lynn Strauman, Jeffrey S. Braden