Abstract: Embodiments relate to a system and method for dissipating heat from a heat generating component. The system and method an assembly of a fenestrated housing and a plenum and positioning of the assembly relate to the heat generating component. The plenum accommodates a fluid mover relative to the fenestrated housing. The fenestrations function to support multi-directional fluid flow created by the fluid mover and accommodated by the fenestrations, which function as ports to direct fluid with respect to the heat generating component.

Abstract: Embodiments relate to a system, an apparatus, and a method that involve a plurality of stackable enclosure units that include inter-unit or inter-module passages for facilitating cooling of interior compartments of the units, especially server units.

Abstract: Embodiments relate to a system with a primary body in communication with at least one heat source. A chamber housed within the primary body includes a boundary to separate the heat source from fluid contact and a secondary body housed in the chamber. The secondary body includes a conduit and a cover in communication with the conduit wherein the cover has a fluid flow inlet extending into the conduit and the conduit includes a series of convection ports to exhaust fluid into the chamber. Upon surging through the convection ports, the fluid comes in contact with the plenum of the primary body and dissipates the heat generated from the heat source and transferred to the primary body. An outlet, separate from the inlet, removes the fluid from the chamber.

Abstract: Embodiments of the invention related to using the fin length of the heat sink extending from an entrance of the heat sink to an interior sectional wall as the heat transfer element to achieve high thermal performance. The sectional wall(s) of the heat sink function to isolate fluid flow communication between the heat sink sections of fin fields, thereby preventing a flow coupling between the fin fields.

Abstract: Embodiments relate to a system with a primary body in communication with at least one heat source. A chamber housed within the primary body includes a boundary to separate the heat source from fluid contact and a secondary body housed in the chamber. The secondary body includes a conduit and a cover in communication with the conduit wherein the cover has a fluid flow inlet extending into the conduit and the conduit includes a series of convection ports to exhaust fluid into the chamber. Upon surging through the convection ports, the fluid comes in contact with the plenum of the primary body and dissipates the heat generated from the heat source and transferred to the primary body. An outlet, separate from the inlet, removes the fluid from the chamber.

Abstract: Embodiments of the invention related to using the fin length of the heat sink extending from an entrance of the heat sink to an interior sectional wall as the heat transfer element to achieve high thermal performance. The sectional wall(s) of the heat sink function to isolate fluid flow communication between the heat sink sections of fin fields, thereby preventing a flow coupling between the fin fields.

Abstract: A heat sink assembly mount is provided. Generally the invention has a frame clip and a spring clip. The frame clip has one or more inwardly extending tabs and two or more vertically extending side portions. The one or more tabs are sized to fit over and removably couple to a heat producing device. The distance between the two or more vertically extending side portions is sized to hold a base portion of a heat sink and prevent horizontal motion of the heat sink. The spring clip couples to the frame clip and has a spring bias sized to produce a vertical force that presses the heat sink against a heat producing device.

Abstract: A board mounted integrated electronics package assembly is provided with one or more securing elements to attach a heat dissipating device directly to the package. The securing element(s) is located along a periphery of the package and anchors a base of the heat dissipating device to the package, thereby eliminating employment of a secondary heat dissipating material between the package and the heat dissipating device.

Abstract: A heat sink assembly mount is provided. Generally the invention has a frame clip and a spring clip. The frame clip has one or more inwardly extending tabs and two or more vertically extending side portions. The one or more tabs are sized to fit over and removably couple to a heat producing device. The distance between the two or more vertically extending side portions is sized to hold a base portion of a heat sink and prevent horizontal motion of the heat sink. The spring clip couples to the frame clip and has a spring bias sized to produce a vertical force that presses the heat sink against a heat producing device.

Abstract: A heat sink assembly mount is provided. Generally the invention has a frame clip and a spring clip. The frame clip has one or more inwardly extending tabs and two or more vertically extending side portions. The one or more tabs are sized to fit over and removably couple to a heat producing device. The distance between the two or more vertically extending side portions is sized to hold a base portion of a heat sink and prevent horizontal motion of the heat sink. The spring clip couples to the frame clip and has a spring bias sized to produce a vertical force that presses the heat sink against a heat producing device.

Abstract: A novel plate fin heat exchanger adapted for high and low velocity fluid flows for dissipating heat from a heat generating component. The heat exchanger comprises an array of fins being affixed to and in thermal communication with a thermally conductive base, wherein the fins are arranged in a fan tail configuration for minimizing flow bypass, and further providing reduced thermal resistance for fluid passing through the fin field. The fins are affixed to and in thermal communication with the base at an acute angle, such that the effective width of the array of fins exceeds the width of the base. The enlarged effective width of the fin array in comparison to conventional heat exchanger provides an increased volume for fluid flow, thereby allowing a greater volume of fluid to enter the fin field and a greater surface area of plate fins for cooling the fluid passing through the heat exchanger.

Abstract: A plurality of substantially similar fins is produced from the thermally conductive and formable sheet stock, for example aluminum or copper, preferably using a set of matched forming dies. Each die in the set produces a fin that is cupped in side elevation. Each fin has two flanges (in the preferred embodiment) extending from the base portion of the cup, and the fin is preferably rectangular in plan. The die cavities are substantially identical in geometry, but differ slightly in dimension so that the base portion of the cup-shaped fin-pair produced by each die in a set varies in width. Each die in the set includes a feature for producing a locating lug or dimple, or alternatively a hole, in each fin produced. The plurality of substantially geometrically identical, but dimensionally differing fin-pairs are then assembled in a nested stack in accordance with the invention.