Abstract: A heat-radiating structure of chip provides effective heat-radiating paths and also maintains good structural stability to protect chips. A bearing rack is connected beside a flip chip type chip on a circuit substrate. The bearing rack is connected with a heat-radiating sheet. A projective portion is disposed at the center of the heat-radiating sheet facing the chip. The surfaces of the projective portion and the chip are connected together through adhesive. Several grooves are disposed on the surface of the heat-radiating sheet facing the chip to reduce the weight of the heat-radiating sheet and maintain its structural rigidity. Each side of the bearing rack is not connected together to avoid regions with a too large local thermal stress. Moreover, heat-spreading paths for hot, air are also provided to prevent the heat-radiating sheet from extra stress due to hot expansion and cold shrinkage during baking in the packaging process.

Abstract: This invention relates to a radiator fin formed by sintering operation, which comprises a base board formed by means of powder metallurgical sintering and a radiator fin formed by the bent metal sheet. The base board has a plurality of equidistant trenches. The radiator fin is bent in the form of continued rectangles to form a hollow grille with multiple segments. The bottom segment of the radiator fin is milled into a slot, which is fit into the base board. The middle of the base of the said radiator fin is fit perfectly into the trench on the base board. By dint of skrinkage occurred during the sintering operation of the base board, and becomes an integral part of the base board.

Abstract: In a heat dissipating device, a heat-conductive base plate is mounted on a flip chip base, and is formed with a through hole that extends from an upper surface to a lower surface opposite to the lower surface and disposed in contact with the flip chip base. A heat-conductive block is formed integrally on the upper surface of the base plate, covers the through hole in the base plate, and has a bottom surface flush with the upper surface of the base plate. The bottom surface is formed with a recess that is registered with the through hole in the base plate such that when the base plate is used to cover the flip chip base, the through hole in the base plate allows the chip device to extend into the recess. Multiple heat-dissipating members are formed integrally on the upper surface of the base plate.

Abstract: A heat dissipation device includes a thermally conductive base plate and a plurality of thermally conductive fin plates that are in thermal communication with the base plate. Each adjacent pair of the fin plates defines a channel therebetween, through which cool air is forced to flow. Each of the fin plates has a proximate side that is proximate to the base plate, a distal side that is opposite to the base plate, and a plurality of integral ribs that extend from the proximate side to the distal side, thereby permitting heat transfer from the proximate side to the distal side along the ribs. In addition, because each of the ribs enables formation of a small turbulent flow of the cool air, a temperature boundary layer of the air is broken in each of the channels, thereby permitting heat transfer from upstream ends of the channels to downstream ends of the channels. Because the sizes of the ribs are relatively small with respect to the widths of the channels, the cool air can flow smoothly through the channels.