Patents Assigned to ADVANCED
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Patent number: 10154878Abstract: An electrosurgical balloon includes an inflatable balloon body formed of a non-conductive substrate material. One or more electrodes are disposed on an exterior surface of the balloon body. The electrodes can include a pair of bipolar electrodes, and the balloon body can have at least one fluid outlet hole configured to provide fluid to the pair of bipolar electrodes. A second inflatable balloon body can be disposed inside the first inflatable balloon body. The electrosurgical balloon can be incorporated into a catheter assembly, in which the electrosurgical balloon is a balloon electrode tip at a distal end of a catheter.Type: GrantFiled: August 1, 2017Date of Patent: December 18, 2018Assignee: Medtronic Advanced Energy LLCInventors: Eliot F. Bloom, Vaclav O. Podany, Chad M. Greenlaw, Brian M. Conley
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Patent number: 10158530Abstract: A cluster computer server is configured after a system reset or other configuration event. Each node of a fabric of the cluster compute server is employed, for purposes of configuration, as a cell in a cellular automaton, thereby obviating the need for a special configuration network to communicate configuration information from a central management unit. Instead, the nodes communicate configuration information using the same fabric interconnect that is used to communicate messages during normal execution of software services at the nodes.Type: GrantFiled: August 18, 2014Date of Patent: December 18, 2018Assignee: Advanced Micro Devices, Inc.Inventors: Michael E. James, Jean-Philippe Fricker
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Patent number: 10158194Abstract: Narrow width fiber optic connectors having spring loaded remote release mechanisms to facilitate access and usage of the connectors in high density arrays. A narrow width fiber optic connector comprises a multi-fiber connector, wherein a width of said narrow width fiber optic connector is less than about 12.4 mm, a housing configured to hold the multi-fiber connector and further comprising a connector recess, and a pull tab having a ramp area configured to disengage a latch of one of an adapter and an SFP from said connector recess. The pull tab may include a spring configured to allow the latch of one of the adapter and the SFP to engage with the connector recess.Type: GrantFiled: February 16, 2016Date of Patent: December 18, 2018Assignee: Senko Advanced Components, Inc.Inventors: Kazuyoshi Takano, Jeffrey Gniadek
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Patent number: 10155202Abstract: A hollow fiber membrane restraining apparatus comprising: first and second horizontal wall parts having slits therethrough, wherein the inner walls face one another; and two vertical wall parts erected facing both end parts of the first horizontal wall parts in a horizontal axis direction, wherein a mat stacking part is formed and stacked on the first horizontal wall part such that end parts of mats on which hollow fiber membranes are arranged in a row can be aligned, and the second horizontal wall part is locked onto the vertical wall parts by pushing and restraining the mat stacking part; a header apparatus comprising the same; a hollow fiber membrane module; and a method for manufacturing a hollow fiber membrane module are provided.Type: GrantFiled: September 29, 2014Date of Patent: December 18, 2018Assignees: LOTTE ADVANCED MATERIALS CO. LTD., LOTTE CHEMICAL CORPORATIONInventors: Eu Mine Suk, Young Soo Son, Dong Hyun Kim, Gyu Hong Min
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Patent number: 10158208Abstract: Provided is a method of measuring a phase noise of a repetition rate of a femtosecond laser including generating a combined signal using a first wavelength element and a second wavelength element of an optical pulse train generated by the femtosecond laser, which is mode-locked, guiding the combined signal to a first path and a second path, allowing a signal of the second path to interfere with the signal of the first path, and outputting an interfering combined signal, dividing the interfering combined signal into a first interference signal and a second interference signal, converting the interference signals to radio frequency signals, and detecting a baseband signal including a frequency noise of the repetition rate from the radio frequency signals using a mixer.Type: GrantFiled: November 20, 2015Date of Patent: December 18, 2018Assignee: KOREA ADVANCED INSTITUE OF SCIENCE AND TECHNOLOGYInventors: Jung Won Kim, Kwang Yun Jung
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Patent number: 10155219Abstract: This invention relates to a hydrogen spillover-based catalyst and use thereof, wherein a hydrogen activation metal cluster is dispersed in the form of being encapsulated in a crystalline or amorphous aluminosilicate matrix which is partially or fully structurally collapsed zeolite, thereby exhibiting high hydroprocessing or dehydrogenation activity and suppressed C—C hydrogenolysis activity.Type: GrantFiled: April 22, 2014Date of Patent: December 18, 2018Assignees: SK INNOVATION CO., LTD., KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Min Kee Choi, Ju Hwan Im, Do Woan Kim, Do Kyoung Kim, Tae Jin Kim, Seung Hoon Oh, Tae Hong Seok
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Patent number: 10155440Abstract: The invention relates to a tank (1) for storing a liquid, comprising a wall (10) made of plastic and a device for stopping the filling of said tank (1) with a liquid at a maximum fill level, this device extending inside the tank (1) and comprising at least one opening (71) of which the position inside the tank (1) fixes the said maximum fill level. The device that stops the filling of this tank (1) comprises a first part formed with the wall (10) and a second part which is fixed hermetically to the first part.Type: GrantFiled: April 10, 2015Date of Patent: December 18, 2018Assignee: Plastic Omnium Advanced Innovation and ResearchInventors: Franck Dhaussy, Gwereg Paolini
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Patent number: 10157887Abstract: A semiconductor device package includes a first circuit layer, at least one electrical element, a first molding layer, an electronic component and a second molding layer. The at least one electrical element is disposed over a first surface of the first circuit layer and electrically connected to the first circuit layer. The first molding layer is disposed over the first surface of the first circuit layer. The first molding layer encapsulates an edge of the at least one electrical element, and a lower surface of the first molding layer and a lower surface of the at least one electrical element are substantially coplanar. The electronic component is disposed over a second surface of the first circuit layer and is electrically connected to the first circuit layer. The second molding layer is disposed over the second surface of the first circuit layer and encapsulates the electronic component.Type: GrantFiled: March 9, 2017Date of Patent: December 18, 2018Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Tien-Szu Chen, Kuang-Hsiung Chen, Sheng-Ming Wang, I-Cheng Wang, Wun-Jheng Syu
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Patent number: 10156685Abstract: An optical-fiber connector includes a handle, a sleeve member, and connecting housings each including a base body and an elastic arm. Each elastic arm includes engaging blocks protruding from the elastic arm and a slidable groove on the corresponding base body. The slidable grooves face each other. The handle includes a handle body between the elastic arms and a handle member extending from the handle body. Two slidable blocks are at two sides of the handle body and respectively inserted into the slidable grooves, and two protruding blocks are at two sides of the handle member. The sleeve member is fitted over the handle member. First and second engaging grooves are on a wall surface of the sleeve member, and the first and second engaging grooves are on different positions of the wall surface of the sleeve member. Accordingly, the length of the handle is adjustable.Type: GrantFiled: March 14, 2018Date of Patent: December 18, 2018Assignee: ADVANCED-CONNECTEK INC.Inventors: Jun Wu, Yang-Yang Cui
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Publication number: 20180358463Abstract: On a front surface of a semiconductor base, a first n?-type drift region and a second n-type drift region are provided. A gate trench is provided that penetrates an n+-type source region and p-type base region, and reaches the second n-type drift region. Between adjacent gate trenches, a contact trench is provided that penetrates the n+-type source region and the p-type base region, and reaches a p-type semiconductor region, through the second n-type drift region. A source electrode embedded in the contact trench is in contact with the p-type semiconductor region at a bottom and corners of the contact trench, and forms a Schottky junction with the second n-type drift region at side walls of the contact trench. A depth of the contact trench is a depth by which a mathematical area of a part thereof forming the Schottky junction is a predetermined mathematical area or greater.Type: ApplicationFiled: May 31, 2018Publication date: December 13, 2018Applicants: FUJI ELECTRIC CO., LTD., NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: Yusuke KOBAYASHI, Naoyuki OHSE, Shinsuke HARADA, Manabu TAKEI
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Publication number: 20180354398Abstract: Disclosed is a Personal Electronic Device (PED) positioning apparatus that stows within a tray table. An articulated holder includes a crossbar arm that slides on at least one support shaft to a position where a crossbar can be rotate to provide an angled surface relative to the tray table to support a PED. When stowed, the crossbar presents a minimal profile with respect to the tray table. The exposed surface of the crossbar can be made to match the color and appearance of the tray table so that the apparatus has minimal visual impact.Type: ApplicationFiled: June 4, 2018Publication date: December 13, 2018Applicant: Astronics Advanced Electronic Systems Corp.Inventors: John S. Lamb, Dennis P. Markert
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Publication number: 20180354936Abstract: The present invention provides novel heterocyclic compounds as anticancer agents, especially as estrogen receptor (ER) antagonists/degraders and process for their preparation.Type: ApplicationFiled: October 26, 2016Publication date: December 13, 2018Applicant: SUN PHARMA ADVANCED RESEARCH COMPANY LIMITEDInventors: Ranjan Kumar PAL, Amit Pravinbhai SEDANI, Kaushikkumar Dhanjibhai PRAJAPATI, Dijixa Pinakin RANA, Sandeep Pankajbhai PATHAK, Japan Nitinkumar DESAI, Jayraj Dilipbhai ARADHYE, Bhavesh Mohanbhai PANCHAL, Indraneel GHOSH, Trinadha Rao CHITTURI
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Publication number: 20180358276Abstract: A semiconductor device package includes: (1) a conductive base comprising a sidewall, a cavity defined from a first surface of the conductive base, the cavity having a bottom surface and a depth; (2) a semiconductor die disposed on the bottom surface of the cavity, the semiconductor die having a first surface and a second surface opposite the first surface, the second surface of the semiconductor die bonded to the bottom surface of the cavity; and (3) a first insulating material covering the sidewall of the conductive base and extending to a bottom surface of the conductive base.Type: ApplicationFiled: August 21, 2018Publication date: December 13, 2018Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chi-Tsung CHIU, Meng-Jen WANG, Cheng-Hsi CHUANG, Hui-Ying HSIEH, Hui Hua LEE
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Publication number: 20180359853Abstract: A semiconductor package device includes a first dielectric layer, a first interconnection layer, a second interconnection layer, and a second dielectric layer. The first dielectric layer has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The first interconnection layer is within the first dielectric layer. The second interconnection layer is on the second surface of the first dielectric layer and extends from the second surface of the first dielectric layer into the first dielectric layer to electrically connect to the first interconnection layer. The second dielectric layer covers the second surface and the lateral surface of the first dielectric layer and the second interconnection layer.Type: ApplicationFiled: June 13, 2017Publication date: December 13, 2018Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ming-Ze LIN, Chia Ching CHEN, Yi Chuan DING
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Publication number: 20180358290Abstract: A semiconductor device package includes a substrate, a first insulation layer, a support film and an interconnection structure. The substrate has a first sidewall, a first surface and a second surface opposite to the first surface. The first insulation layer is on the first surface of the substrate and has a second sidewall. The first insulation layer has a first surface and a second surface adjacent to the substrate and opposite to the first surface of the first insulation layer. The support film is on the second surface of the substrate and has a third sidewall. The support film has a first surface adjacent to the substrate and a second surface opposite to the first surface of the support film. The interconnection structure extends from the first surface of the first insulation layer to the second surface of the support film via the first insulation layer and the support film. The interconnection structure covers the first, second and third sidewalls.Type: ApplicationFiled: June 8, 2017Publication date: December 13, 2018Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chien-Hua CHEN, Ming-Hung CHEN, Hsu-Chiang SHIH
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Publication number: 20180354358Abstract: A valve apparatus for use in a liquid tank, includes a casing, an extractor, and a float. The casing defines a main chamber, the main chamber having an inlet orifice and at least one outlet orifice. The extractor includes at least one wall member extending substantially across the main chamber and being adapted for extracting droplets present in a vapour stream coming from the liquid tank and entering the main chamber via the inlet orifice. The float includes a closure element capable of closing off the outlet orifice(s), the float being slidably mounted along the at least one wall member.Type: ApplicationFiled: December 7, 2016Publication date: December 13, 2018Applicant: Plastic Omnium Advanced Innovation and ResearchInventors: Dominique MADOUX, Jules-Joseph VAN SCHAFTINGEN
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Publication number: 20180358501Abstract: A semiconductor package device comprises a substrate, a light emitter, a light detector and a transparent conductive film. The substrate as a first surface and a second surface opposite to the first surface. The light emitter is disposed on the first surface of the substrate and has a light emission area adjacent to the first surface of the substrate. The light detector is disposed on the first surface of the substrate and has a light receiving area adjacent to the first surface of the substrate. The transparent conducting film is disposed on the second surface of the substrate.Type: ApplicationFiled: June 9, 2017Publication date: December 13, 2018Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Cheng-Ling HUANG, Ying-Chung CHEN
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Publication number: 20180358291Abstract: A method for manufacturing a semiconductor device package includes providing a substrate having a first surface and a second surface opposite to the first surface; disposing a passive component layer on the first surface of the substrate; after disposing the passive component layer, forming at least one via in the substrate, wherein the via penetrates the substrate and the passive component layer; and disposing a conductive layer on the passive component layer and filling the via with the conductive layer.Type: ApplicationFiled: June 8, 2017Publication date: December 13, 2018Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chien-Hua CHEN, Sheng-Chi HSIEH, Cheng-Yuan KUNG
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Patent number: 10152842Abstract: A beverage vending machine includes at least one outer casing with at least one magazine for accommodating agricultural products of fruit and vegetables. The machine is functionally associated with at least one device for centrifugal juicing of the agricultural products to obtain a centrifugally juiced fraction that can be utilized outside the casing. The centrifugal juicing device includes at least one element for the automatic pressing of at least one agricultural product to be subjected to centrifugal juicing against a rotating reference surface, affected by a component for automatically shredding the agricultural product supplied by the magazine for its optimum centrifugal juicing.Type: GrantFiled: December 22, 2015Date of Patent: December 11, 2018Assignee: A.A.T. AGROINDUSTRY ADVANCED TECHNOLOGIES S.P.A.Inventors: Marcello Nunzio Catalano, Salvatore Maria Vittorio Torrisi, Antonio Giallanza
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Patent number: 10152434Abstract: A system and method for efficient arbitration of memory access requests are described. One or more functional units generate memory access requests for a partitioned memory. An arbitration unit stores the generated requests and selects a given one of the stored requests. The arbitration unit identifies a given partition of the memory which stores a memory location targeted by the selected request. The arbitration unit determines whether one or more other stored requests access memory locations in the given partition. The arbitration unit sends each of the selected memory access request and the identified one or more other memory access requests to the memory to be serviced out of order.Type: GrantFiled: December 20, 2016Date of Patent: December 11, 2018Assignees: Advanced Micro Devices, Inc., ATI Technologies ULCInventors: Rostyslav Kyrychynskyi, Anthony Asaro, Kostantinos Danny Christidis, Mark Fowler, Michael J. Mantor, Robert Scott Hartog