Abstract: A method and apparatus for constructing MEMS devices is provided which employs a low cost molded housing that simultaneously provides precise and accurate alignment, mechanical protection, electrical connections and structural integrity for mounting optical and MEMS components. The package includes a MEMS die mounting surface, an optical component mounting surface and an optical imaging window monolithically fabricated with the MEMS die mounting surface in a predetermined orientation for providing alignment between the MEMS die and optical components. A MEMS adaptor plate is provided to facilitate connections of a MEMS die to external components.
Type:
Grant
Filed:
March 28, 2008
Date of Patent:
April 28, 2015
Assignee:
AdvancedMEMS LLP
Inventors:
Albert Ting, Daniel T. McCormick, Michael Rattner