Patents Assigned to Advances Optoelectronic Technology, Inc.
  • Package structure for solid-state lighting devices and method of fabricating the same
    Patent number: 7989237
    Abstract: Silicon substrates are applied to the package structure of solid-state lighting devices. Wet etching is performed to both top and bottom surfaces of the silicon substrate to form reflecting cavity and electrode access holes. Materials of the reflecting layer and electrode can be different from each other whose preferred materials can be chosen in accordance with a correspondent function. Formation of the electrode can be patterned by an etching method or a lift-off method.
    Type: Grant
    Filed: September 25, 2008
    Date of Patent: August 2, 2011
    Assignee: Advances Optoelectronic Technology, Inc.
    Inventors: Wen Liang Tseng, Lung Hsin Chen