Patents Assigned to Advanpak Solutions Pte. Ltd.
  • Pillar connections for semiconductor chips and method of manufacture
    Patent number: 6681982
    Abstract: A flip chip interconnect system comprises and elongated pillar comprising two elongated portions, one portion including copper and another portion including solder. The portion including copper is in contact with the semiconductor chip and has a length preferably of more than 55 microns to reduce the effect of &agr; particles from the solder from affecting electronic devices on the chip. The total length of the pillar is preferably in the range of 80 to 120 microns.
    Type: Grant
    Filed: June 12, 2002
    Date of Patent: January 27, 2004
    Assignee: Advanpak Solutions Pte. Ltd.
    Inventor: Francisca Tung