Patents Assigned to ADVENTIVE IPBANK
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Patent number: 10615146Abstract: A variety of footed and leadless semiconductor packages, with either exposed or isolated die pads, are described. Some of the packages have leads with highly coplanar feet that protrude from a plastic body, facilitating mounting the packages on printed circuit boards using wave-soldering techniques.Type: GrantFiled: July 21, 2018Date of Patent: April 7, 2020Assignee: Adventive IPBankInventors: Richard K. Williams, Keng-Hung Lin
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Patent number: 10312111Abstract: A method is disclosed of fabricating a power package which includes a heat tab extending from a die pad exposed on the underside of the package, which facilitates the removal of heat from the die to the PCB or other surface on which the package is mounted. The heat tab has a bottom surface coplanar with the flat bottom surface of the die pad and bottom surface of a lead. The lead includes a horizontal foot segment, a vertical columnar segment, and a horizontal cantilever segment facing the die pad. The heat tab may also have a foot. A die containing a power device is mounted on a top surface of the die pad and may be electrically connected to the lead using a bonding wire or clip. The die may be mounted on the die pad with an electrically conductive material, and the package may also include a lead that extends from the die pad and is thus electrically tied to the bottom of the die.Type: GrantFiled: July 20, 2018Date of Patent: June 4, 2019Assignee: Adventive IPBankInventors: Richard K. Williams, Keng Hung Lin
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Publication number: 20180343741Abstract: A rigid-flex PCB includes an array of rigid PCB “islands” interconnected by a flexible PCB formed into flexible connectors. The conductive and insulating layers of the flexible PCB extend into the rigid PCBs, giving the electrical connections to the rigid PCBs added resistance to breakage as the rigid-flex PCB is repeatedly stressed by bending and twisting forces. In addition, the durability of the rigid-flex PCB is enhanced by making the power and signal lines driving the rigid PCBs redundant so that a breakage of a line will not necessarily affect the operation of the rigid PCB to which it is attached. The rigid-flex PCB is particularly applicable to light pads used in phototherapy, wherein LEDs mounted on the rigid-PCBs are powered and controlled through the redundant lines in the flexible PCB.Type: ApplicationFiled: August 5, 2018Publication date: November 29, 2018Applicant: Adventive IPBankInventors: Richard K. Williams, Keng Hung Lin
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Publication number: 20180331067Abstract: A variety of footed and leadless semiconductor packages, with either exposed or isolated die pads, are described. Some of the packages have leads with highly coplanar feet that protrude from a plastic body, facilitating mounting the packages on printed circuit boards using wave-soldering techniques.Type: ApplicationFiled: July 21, 2018Publication date: November 15, 2018Applicant: Adventive IPBankInventors: Richard K. Williams, Keng-Hung Lin
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Publication number: 20180330968Abstract: A method is disclosed of fabricating a power package which includes a heat tab extending from a die pad exposed on the underside of the package, which facilitates the removal of heat from the die to the PCB or other surface on which the package is mounted. The heat tab has a bottom surface coplanar with the flat bottom surface of the die pad and bottom surface of a lead. The lead includes a horizontal foot segment, a vertical columnar segment, and a horizontal cantilever segment facing the die pad. The heat tab may also have a foot. A die containing a power device is mounted on a top surface of the die pad and may be electrically connected to the lead using a bonding wire or clip. The die may be mounted on the die pad with an electrically conductive material, and the package may also include a lead that extends from the die pad and is thus electrically tied to the bottom of the die.Type: ApplicationFiled: July 20, 2018Publication date: November 15, 2018Applicant: Adventive IPBankInventors: Richard K. Williams, Keng Hung Lin
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Patent number: 10064276Abstract: A rigid-flex PCB includes an array of rigid PCB “islands” interconnected by a flexible PCB formed into flexible connectors. The conductive and insulating layers of the flexible PCB extend into the rigid PCBs, giving the electrical connections to the rigid PCBs added resistance to breakage as the rigid-flex PCB is repeatedly stressed by bending and twisting forces. In addition, the durability of the rigid-flex PCB is enhanced by making the power and signal lines driving the rigid PCBs redundant so that a breakage of a line will not necessarily affect the operation of the rigid PCB to which it is attached. The rigid-flex PCB is particularly applicable to light pads used in phototherapy, wherein LEDs mounted on the rigid-PCBs are powered and controlled through the redundant lines in the flexible PCB.Type: GrantFiled: October 21, 2015Date of Patent: August 28, 2018Assignee: Adventive IPBankInventors: Richard K Williams, Keng Hung Lin
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Patent number: 10032744Abstract: A variety of footed and leadless semiconductor packages, with either exposed or isolated die pads, are described. Some of the packages have leads with highly coplanar feet that protrude from a plastic body, facilitating mounting the packages on printed circuit boards using wave-soldering techniques.Type: GrantFiled: January 25, 2017Date of Patent: July 24, 2018Assignee: Adventive IPBankInventors: Richard K. Williams, Keng-Hung Lin
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Patent number: 10032649Abstract: A method is disclosed of fabricating a power package which includes a heat tab extending from a die pad exposed on the underside of the package, which facilitates the removal of heat from the die to the PCB or other surface on which the package is mounted. The heat tab has a bottom surface coplanar with the flat bottom surface of the die pad and bottom surface of a lead. The lead includes a horizontal foot segment, a vertical columnar segment, and a horizontal cantilever segment facing the die pad. The heat tab may also have a foot. A die containing a power device is mounted on a top surface of the die pad and may be electrically connected to the lead using a bonding wire or clip. The die may be mounted on the die pad with as electrically conductive material, and the package may also include a lead that extends from the die pad and is thus electrically tied to the bottom of the die.Type: GrantFiled: March 8, 2017Date of Patent: July 24, 2018Assignee: Adventive IPBankInventors: Richard K. Williams, Keng Hung Lin
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Patent number: 10008438Abstract: In a semiconductor package a lead having a bottom surface coplanar with the flat bottom surface of the plastic body extends outward at the bottom of the vertical side surface of the plastic body. The result is a package with a minimal footprint that is suitable for the technique known as “wave soldering” that is used in relatively low-cost printed circuit board assembly factories. Methods of fabricating the package are disclosed, in particular a method of fabricating a package including an exposed die pad.Type: GrantFiled: October 16, 2017Date of Patent: June 26, 2018Assignee: Adventive IPBankInventor: Richard K Williams
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Publication number: 20180040545Abstract: In a semiconductor package a lead having a bottom surface coplanar with the flat bottom surface of the plastic body extends outward at the bottom of the vertical side surface of the plastic body. The result is a package with a minimal footprint that is suitable for the technique known as “wave soldering” that is used in relatively low-cost printed circuit board assembly factories. Methods of fabricating the package are disclosed, in particular a method of fabricating a package including an exposed die pad.Type: ApplicationFiled: October 16, 2017Publication date: February 8, 2018Applicant: Adventive IPBankInventor: Richard K. Williams
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Publication number: 20170178928Abstract: A method is disclosed of fabricating a power package which includes a heat tab extending from a die pad exposed on the underside of the package, which facilitates the removal of heat from the die to the PCB or other surface on which the package is mounted. The heat tab has a bottom surface coplanar with the flat bottom surface of the die pad and bottom surface of a lead. The lead includes a horizontal foot segment, a vertical columnar segment, and a horizontal cantilever segment facing the die pad. The heat tab may also have a foot. A die containing a power device is mounted on a top surface of the die pad and may be electrically connected to the lead using a bonding wire or clip. The die may be mounted on the die pad with as electrically conductive material, and the package may also include a lead that extends from the die pad and is thus electrically tied to the bottom of the die.Type: ApplicationFiled: March 8, 2017Publication date: June 22, 2017Applicant: Adventive IPBankInventors: Richard K. Williams, Keng Hung Lin
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Publication number: 20170170144Abstract: A variety of footed and leadless semiconductor packages, with either exposed or isolated die pads, are described. Some of the packages have leads with highly coplanar feet that protrude from a plastic body, facilitating mounting the packages on printed circuit boards using wave-soldering techniques.Type: ApplicationFiled: January 25, 2017Publication date: June 15, 2017Applicant: Adventive IPBankInventors: Richard K. Williams, Keng-Hung Lin
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Publication number: 20170133304Abstract: In a semiconductor package a lead having a bottom surface coplanar with the flat bottom surface of the plastic body extends outward at the bottom of the vertical side surface of the plastic body. The result is a package with a minimal footprint that is suitable for the technique known as “wave soldering” that is used in relatively low-cost printed circuit board assembly factories. Methods of fabricating the package are disclosed.Type: ApplicationFiled: January 13, 2017Publication date: May 11, 2017Applicant: Adventive IPBankInventor: Richard K Williams
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Publication number: 20170118838Abstract: A rigid-flex PCB includes an array of rigid PCB “islands” interconnected by a flexible PCB formed into flexible connectors. The conductive and insulating layers of the flexible PCB extend into the rigid PCBs, giving the electrical connections to the rigid PCBs added resistance to breakage as the rigid-flex PCB is repeatedly stressed by bending and twisting forces. In addition, the durability of the rigid-flex PCB is enhanced by making the power and signal lines driving the rigid PCBs redundant so that a breakage of a line will not necessarily affect the operation of the rigid PCB to which it is attached. The rigid-flex PCB is particularly applicable to light pads used in phototherapy, wherein LEDs mounted on the rigid-PCBs are powered and controlled through the redundant lines in the flexible PCB.Type: ApplicationFiled: October 21, 2015Publication date: April 27, 2017Applicant: ADVENTIVE IPBANKInventors: Richard K. Williams, Keng Hung Lin
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Patent number: 9620439Abstract: A power package includes a heat tab extending from a die pad exposed on the underside of the package, which facilitates the removal of heat from the die to the PCB or other surface on which the package is mounted. The heat tab has a bottom surface coplanar with the flat bottom surface of the die pad and bottom surface of a lead. The lead includes a horizontal foot segment, a vertical columnar segment, and a horizontal cantilever segment facing the die pad. The heat tab may also have a foot. A die containing a power device is mounted on a top surface of the die pad and may be electrically connected to the lead using a bonding wire or clip. The die may be mounted on the die pad with an electrically conductive material, and the package may also include a lead that extends from the die pad and is thus electrically tied to the bottom of the die.Type: GrantFiled: May 4, 2015Date of Patent: April 11, 2017Assignee: Adventive IPBankInventors: Richard K. Williams, Keng Hung Lin
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Patent number: 9576884Abstract: In a semiconductor package a lead having a bottom surface coplanar with the flat bottom surface of the plastic body extends outward at the bottom of the vertical side surface of the plastic body. The result is a package with a minimal footprint that is suitable for the technique known as “wave soldering” that is used in relatively low-cost printed circuit board assembly factories. Methods of fabricating the package are disclosed.Type: GrantFiled: October 17, 2013Date of Patent: February 21, 2017Assignee: ADVENTIVE IPBANKInventor: Richard K Williams
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Patent number: 9576932Abstract: In the fabrication of semiconductor packages, a leadframe is formed by masking and etching a metal sheet from both sides, and a plastic block is formed over a plurality of dice attached to die pads in the leadframe. A laser beam is used to form individual plastic capsules for each package, and a second laser beam is used to singulate the packages by severing the metal conductors, tie bars and rails between the packages. A wide variety of different types of packages, from gull-wing footed packages to leadless packages, with either exposed or isolated die pads, may be fabricated merely by varying the patterns of the openings in the mask layers and the width of the plastic trenches created by the first laser beam.Type: GrantFiled: July 10, 2015Date of Patent: February 21, 2017Assignee: ADVENTIVE IPBANKInventors: Richard K. Williams, Keng Hung Lin
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Publication number: 20150380384Abstract: In the fabrication of semiconductor packages, a leadframe is formed by masking and etching a metal sheet from both sides, and a plastic block is formed over a plurality of dice attached to die pads in the leadframe. A laser beam is used to form individual plastic capsules for each package, and a second laser beam is used to singulate the packages by severing the metal conductors, tie bars and rails between the packages. A wide variety of different types of packages, from gull-wing footed packages to leadless packages, with either exposed or isolated die pads, may be fabricated merely by varying the patterns of the openings in the mask layers and the width of the plastic trenches created by the first laser beam.Type: ApplicationFiled: July 10, 2015Publication date: December 31, 2015Applicant: ADVENTIVE IPBANKInventors: Richard K. Williams, Keng Hung Lin
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Publication number: 20150311144Abstract: A power package includes a heat tab extending from a die pad exposed on the underside of the package, which facilitates the removal of heat from the die to the PCB or other surface on which the package is mounted. The heat tab has a bottom surface coplanar with the flat bottom surface of the die pad and bottom surface of a lead. The lead includes a horizontal foot segment, a vertical columnar segment, and a horizontal cantilever segment facing the die pad. The heat tab may also have a foot. A die containing a power device is mounted on a top surface of the die pad and may be electrically connected to the lead using a bonding wire or clip. The die may be mounted on the die pad with an electrically conductive material, and the package may also include a lead that extends from the die pad and is thus electrically tied to the bottom of the die.Type: ApplicationFiled: May 4, 2015Publication date: October 29, 2015Applicant: ADVENTIVE IPBANKInventors: Richard K. Williams, Keng Hung Lin
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Publication number: 20140306330Abstract: In a semiconductor package a lead having a bottom surface coplanar with the flat bottom surface of the plastic body extends outward at the bottom of the vertical side surface of the plastic body. The result is a package with a minimal footprint that is suitable for the technique known as “wave soldering” that is used in relatively low-cost printed circuit board assembly factories. Methods of fabricating the package are disclosed.Type: ApplicationFiled: October 17, 2013Publication date: October 16, 2014Applicant: ADVENTIVE IPBANKInventor: Richard K. Williams