Abstract: A technique for stable, high-speed treatment of reinforcement fiber. In a state where a unidirectional fiber bundle is held between a supporting surface of a support and a pressing surface of a resonator ultrasonically vibrating in a pressing direction perpendicular to the supporting surface, a pressed part of the unidirectional fiber bundle pressed by the pressing surface is moved in a longitudinal direction of the unidirectional fiber bundle. By doing so, the unidirectional fiber bundle can be stably treated at high speed when the unidirectional fiber bundle is opened or impregnated with a resin.

Abstract: A compact pressing body with a pressing surface smaller in area than a welding range welds together sheet-like members over the whole area of the welding range by pressing the sheet-like members being reliably moved in a direction substantially orthogonal to a pressing direction of the pressing body.

Abstract: The purpose of the invention is to provide a mounting apparatus that can mount a part such as a chip, etc. on a substrate effectively and precisely. A wafer is placed on the upper surface of turntable, which has opening section, and a backup section and a head section that hold a chip are lifted up and lowered respectively, at opening section. The wafer and the chip are contacted, pinched and held locally, and then they are heat-bonded. After that, the backup section and the head section are removed. Lift arms equipped on a holding table are inserted between the wafer and turntable, the wafer is lifted up, and opening section is moved relative to the wafer when turntable is rotated. The wafer is placed on turntable again and the bonding process is performed.

Abstract: Provided is a technique which can prevent abnormal vibrations from occurring on a resonator and apply, to a putting edge, vibrations with the magnitude of amplitude thereof adjusted in the direction of width of the edge, thereby cutting an object of interest with high accuracy. The resonator (21) with a grip portion grasped with clamp means (28) is supported by a support means (24), thereby preventing abnormal vibrations from occurring on the resonator (21). The resonator (21) has at least one elongated hole (26b) defined through a side thereof, thus allowing for adjusting the amplitude magnitude of vibrations in the direction of width of the cutting edge (23) on one end of the resonator (21). This enables vibrations with the amplitude of an adjusted magnitude in the direction of width to be applied to the cutting edge (23). Accordingly, the cutting edge (23) which is adequately vibrated can be used to cut the object of interest with high accuracy.

Abstract: The purpose of this invention is to provide a support device for a resonator that can support the resonator at an optional location, can let the resonator vibrate with a specified vibration consistently, and can apply an ultrasonic vibration to objects efficiently. By inserting first clamping means and second clamping means, which comprise supporting member at least at each contacting portion, into first portion-to-be-supported and second portion-to-be-supported of resonator, the resonator is supported. As substances of the supporting member, substances that have a logarithmic decrement higher than 0.01 and lower than 1.0 and/or a sound propagation speed of more than 5900 m/s are suitable.

Abstract: The purpose of the invention is to provide a mounting apparatus that can mount a part such as a chip, etc. on a substrate effectively and precisely. A wafer is placed on the upper surface of turntable, which has opening section, and a backup section and a head section that hold a chip are lifted up and lowered respectively, at opening section. The wafer and the chip are contacted, pinched and held locally, and then they are heat-bonded. After that, the backup section and the head section are removed. Lift arms equipped on a holding table are inserted between the wafer and turntable, the wafer is lifted up, and opening section is moved relative to the wafer when turntable is rotated. The wafer is placed on turntable again and the bonding process is performed.

Abstract: The purpose of this invention is to provide a support device for a resonator that can support the resonator at an optional location, can let the resonator vibrate with a specified vibration consistently, and can apply an ultrasonic vibration to objects efficiently. By inserting first clamping means and second clamping means, which comprise supporting member at least at each contacting portion, into first portion-to-be-supported and second portion-to-be-supported of resonator, the resonator is supported. As substances of the supporting member, substances that have a logarithmic decrement higher than 0.01 and lower than 1.0 and/or a sound propagation speed of more than 5900 m/s are suitable.